2023 Fiscal Year Final Research Report
Micro-integrated wires with built-in 3D sensor structure
| Project/Area Number |
21K18158
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| Research Category |
Grant-in-Aid for Challenging Research (Pioneering)
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| Allocation Type | Multi-year Fund |
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| Review Section |
Medium-sized Section 18:Mechanics of materials, production engineering, design engineering, and related fields
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| Research Institution | Nagoya University |
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Principal Investigator |
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| Co-Investigator(Kenkyū-buntansha) |
東 直輝 名古屋大学, 工学研究科, 助教 (50823283)
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| Project Period (FY) |
2021-07-09 – 2024-03-31
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| Keywords | フレキシブルセンサ / MEMS |
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| Outline of Final Research Achievements |
In this study, we proposed a new method of forming three-dimensional microstructures using flexible films, and attempted to establish a basic technology for micro-integrated wires with built-in micro-mechanical quantity sensors using three-dimensional structures. The flexibility of flexible films, which makes handling difficult, is utilized to enable multilayering without the need for alignment. We confirmed that it is possible to construct a capacitance sensor with a three-dimensional structure using flexible film with metal wiring and through-holes, and succeeded in confirming the principle of constructing capacitance sensor as a force sensor.
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| Free Research Field |
ナノ計測工学
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| Academic Significance and Societal Importance of the Research Achievements |
フレキシブルフィルムのハンドリングは柔軟さゆえに困難であったが，本研究では，逆にその柔軟性を利用して，2次元構造から3次元構造への変換について新しい方法論を提案し，作製法としての原理確認に成功した．さらに，力センサとして機能することが確認できた．本方法は，これまでになかった3次元構造を集積化したフレキシブルワイヤという新規なデバイスの実現を可能とする．さらに，微細化を進めれば，様々な形状の対象に対応できる．ウェアラブルセンシングや物体に埋め込み物体内部のセンシングも期待される．
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