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2013 Fiscal Year Final Research Report

On mechanism of microbubble emission boiling and the application for high heat flux cooling technology

Research Project

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Project/Area Number 23560246
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Thermal engineering
Research InstitutionTokyo University of Science, Yamaguchi

Principal Investigator

SUZUKI Koichi  山口東京理科大学, 工学部, 教授 (10089378)

Project Period (FY) 2011 – 2013
Keywordsサブクール沸騰 / 気泡微細化沸騰 / 高熱流束 / パワーエレクトロニクス / 沸騰冷却 / 不凍液媒体 / マイクロチャンネル / 気液界面
Research Abstract

A subcooled pool boiling has been performed for the purpose of developing high heat flux cooling technology. Microbubble emission boiling (MEB) has occurred for a mixture of anti-freezing liquid and water. The heat flux increases higher than the critical heat flux (CHF). In the boiling of water under the pressurized condition of 0.1MPa in gage for an example, MEB occurs and the heat flux increases higher than the CHF. In subcooled flow boiling in a microchannel, the vapor fills whole of the channel and the boiling turns to film boiling. These experimental results give effective information for the practical cooling technology.
In subcooled pool boiling of water in an acoustic field, MEB has been observed at frequency of 500Hz. According to the PIV analysis of microbubbles in MEB, the subcooled liquid has been observed to flow into the heating surface. The experimental results give the mechanism of MEB and solid-liquid contact.

  • Research Products

    (16 results)

All 2014 2013 2012 2011

All Journal Article (3 results) Presentation (10 results) (of which Invited: 2 results) Book (3 results)

  • [Journal Article] Microbubble Emission Boiling of Binary Mixtures (Advanced cooling technology for future power electronics)2013

    • Author(s)
      Koichi Suzuki, Kazuhisa Yuki, Gang Chen, Cyungpyo Hong
    • Journal Title

      ICMF-2013; Intel. Conf. on Multiphase Flow

      Volume: ICMF2013-946

  • [Journal Article] High Heat Flux Cooling Technology for Power Electronics (Subcooled Boiling of Water Mixture of Antifreeze Coolants)2012

    • Author(s)
      K. Suzuki, K. Yuki, G. Chen and C. Hong
    • Journal Title

      Proc. ISTP23

      Volume: paper No.222

  • [Journal Article] Application of Boiling Heat Transfer to High Heat Flux Cooling Technology in Power Electronics2011

    • Author(s)
      Koichi Suzuki, Kazuhisa Yuki, Masataka Mochizuki
    • Journal Title

      Transaction of Institute of Electronics Packaging

      Volume: Vol.4, No.1 Pages: 52-60

  • [Presentation] 気泡微細化沸騰の高熱流束冷却技術への応用2013

    • Author(s)
      鈴木康一,結城和久,陳燕
    • Organizer
      日本機械学会熱工学コンファレンス
    • Place of Presentation
      弘前大学
    • Year and Date
      2013-10-19
  • [Presentation] Subcooled Boiling with Microbubble Emission (Application for high heat flux cooling device in Power electronics)2013

    • Author(s)
      Koichi Suzuki, Kazuhisa Yuki, Yen Chen
    • Organizer
      9^<th> UK-J Seminar on Multi-Phase Flow
    • Place of Presentation
      Brunel University, London
    • Year and Date
      2013-09-16
  • [Presentation] 次世代高熱流束冷却技術(気泡微細化沸騰の実用化にむけて)2013

    • Author(s)
      鈴木康一,結城和久
    • Organizer
      日本混相流学会混相流シンポジウム
    • Place of Presentation
      信州大学
    • Year and Date
      2013-08-09
  • [Presentation] Microbubble Emission Boiling of Binary Mixtures (Advanced cooling technology for future power electronics)2013

    • Author(s)
      Koichi Suzuki, Kazuhisa Yuki, Gang Chen, Cyungpyo Hong
    • Organizer
      Intel. Conf.Multi-phase Flow
    • Place of Presentation
      Jeju国際会議場,韓国
    • Year and Date
      2013-05-26
  • [Presentation] High Heat Flux Cooling Technology for Power Electronics (Subcooled Boiling of Water Mixture of Antifreeze Coolants)2012

    • Author(s)
      K. Suzuki, K. Yuki, G. Chen and C. Hong
    • Organizer
      ISTP23
    • Place of Presentation
      Aucland University, New Zee Land
    • Year and Date
      2012-11-19
  • [Presentation] Advanced Cooling Technology for Next Generation Power Electronics2012

    • Author(s)
      Koichi Suzuki
    • Organizer
      7th Intel.Symp.on Two-Phase Systems for Ground and Space applications
    • Place of Presentation
      北京香山飯店会議場
    • Year and Date
      2012-09-17
    • Invited
  • [Presentation] 微細重力環境における高熱流束輸送技術にむけて;気泡微細化を伴うサブクール沸騰2012

    • Author(s)
      鈴木康一,結城和久,陳剛
    • Organizer
      日本混相流学会年会講演会2012
    • Place of Presentation
      東京大学柏キャンパス
    • Year and Date
      2012-08-09
    • Invited
  • [Presentation] Subcooled Boling with Microbubble Emission( On mechanisu of MEB generation)2011

    • Author(s)
      Koichi Suzuki, Kazuhisa Yuki, Chunpyo Hong
    • Organizer
      22nd Intel.Symp. on Transport Phenomena
    • Place of Presentation
      Delft Technical University, Netherland
    • Year and Date
      2011-11-09
  • [Presentation] Observation of Bubbles on Wetting Surface in Subcooled Boiling2011

    • Author(s)
      鈴木康一
    • Organizer
      11th Asian Symposiumu on Visualization
    • Place of Presentation
      Toki Messe,新潟
    • Year and Date
      2011-06-05
  • [Presentation] Application of Boiling Heat Transfer to High Flux Cooling Technology in Power Electronics2011

    • Author(s)
      鈴木康一,結城和久,望月正孝
    • Organizer
      Intel. Conf. on Electronics Packaging
    • Place of Presentation
      奈良国際会議場
    • Year and Date
      2011-04-13
  • [Book] RC256エレクトロニクス実装のプロセスと製品における信頼性評価と熱制御に関する研究分科会研究報告書2014

    • Author(s)
      鈴木康一,結城和久(分担執筆)
    • Total Pages
      605
    • Publisher
      一般社団法人日本機械学会
  • [Book] 月刊ディスプレイ11月号(連載伝熱工学。沸騰)2013

    • Author(s)
      鈴木康一
    • Total Pages
      104
    • Publisher
      株式会社テクノタイムズ
  • [Book] RC248電子実装における信頼性設計と熱制御に関する研究分科会2012

    • Author(s)
      鈴木康一他
    • Total Pages
      691(分担執筆675-691)
    • Publisher
      一般社団法人日本機械学会

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Published: 2015-07-16  

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