| Project/Area Number |
15K13882
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Thermal engineering
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
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| Project Period (FY) |
2015-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2016: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2015: ¥2,210,000 (Direct Cost: ¥1,700,000、Indirect Cost: ¥510,000)
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| Keywords | ナノマイクロ熱工学 / フォノン / 熱伝導 / ナノ界面 / シリコンナノ粒子 / 界面 / 熱電発電 |
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| Outline of Final Research Achievements |
Silicon nanoparticles (SiNPs) with a mean diameter of 6 nm and Polystyrene (PS) nanocomposites were synthesized, and their thermal conductivity, including the density and specific heat, was compared with well-crystalized SiNPs and PS nanocomposite. The difference between amorphous and crystalline structure is insignificant, but phonon scattering at SiNPs and PS boundary is the key influencing factor of thermal conductivity reduction, showing the thermal boundary resistance (TBR), explained by Kapitza principle, of 4×10-7 m2K/W. Meanwhile, SiNPs are agglomerated in the PS matrix due to phase separation phenomena. In order to improve dispersibility of SiNPs over PS matrix, organic surface passivation with 1-dodecene was successfully carried out onto SiNPs. Thermal conductivity of SiNPs/PS nanocomposite was further investigated and the effect of nanoparticle agglomeration on phonon transport phenomena is experimentally clarified.
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