| Project/Area Number |
15K14139
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Composite materials/Surface and interface engineering
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| Research Institution | Tohoku University |
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Principal Investigator |
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| Co-Investigator(Kenkyū-buntansha) |
長井 千里 東北大学, 未来科学技術共同研究センター, 技術補佐員 (70718353)
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| Co-Investigator(Renkei-kenkyūsha) |
Bea Jichel 東北大学, 未来科学技術共同研究センター, 助教 (40509874)
Onishi Masaki 東北大学, 未来科学技術共同研究センター, 産学官連携研究員 (20618615)
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| Project Period (FY) |
2015-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2016: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
Fiscal Year 2015: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
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| Keywords | 接着 / 接合界面 / 気相堆積ポリイミド / SiO2 / CVD / TSV |
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| Outline of Final Research Achievements |
Adhesion mechanism between a thin SiO2 layer formed plasma-CVD at 200 degreeC and a vapor deposited polyimide was studied. The objective of this research is focusing on adhesion strength enhancement using a dendritic anchor effect of the low-temperature deposited Kapton-type polyimide in order to increase reliability of TSV (through-Silicon Vias) to be used for next-generation 3D stacked integrated circuits. The adhesion enhancement mechanism is found to be based on intermolecular interactions between the polyimide and SAM (self-assembled monolayer)-based adhesion promoters in addition to physical shallow anchor effects.
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