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Adhesion Study Based on Dendritic Anchor Effects on Glass/Polymer Interfaces

Research Project

Project/Area Number 15K14139
Research Category

Grant-in-Aid for Challenging Exploratory Research

Allocation TypeMulti-year Fund
Research Field Composite materials/Surface and interface engineering
Research InstitutionTohoku University

Principal Investigator

Fukushima Takafumi  東北大学, 工学研究科, 准教授 (10374969)

Co-Investigator(Kenkyū-buntansha) 長井 千里  東北大学, 未来科学技術共同研究センター, 技術補佐員 (70718353)
Co-Investigator(Renkei-kenkyūsha) Bea Jichel  東北大学, 未来科学技術共同研究センター, 助教 (40509874)
Onishi Masaki  東北大学, 未来科学技術共同研究センター, 産学官連携研究員 (20618615)
Project Period (FY) 2015-04-01 – 2017-03-31
Project Status Completed (Fiscal Year 2016)
Budget Amount *help
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2016: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
Fiscal Year 2015: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Keywords接着 / 接合界面 / 気相堆積ポリイミド / SiO2 / CVD / TSV
Outline of Final Research Achievements

Adhesion mechanism between a thin SiO2 layer formed plasma-CVD at 200 degreeC and a vapor deposited polyimide was studied. The objective of this research is focusing on adhesion strength enhancement using a dendritic anchor effect of the low-temperature deposited Kapton-type polyimide in order to increase reliability of TSV (through-Silicon Vias) to be used for next-generation 3D stacked integrated circuits. The adhesion enhancement mechanism is found to be based on intermolecular interactions between the polyimide and SAM (self-assembled monolayer)-based adhesion promoters in addition to physical shallow anchor effects.

Report

(3 results)
  • 2016 Annual Research Report   Final Research Report ( PDF )
  • 2015 Research-status Report
  • Research Products

    (6 results)

All 2017 2016 2015

All Journal Article (2 results) (of which Int'l Joint Research: 1 results,  Peer Reviewed: 2 results,  Open Access: 1 results) Presentation (4 results) (of which Int'l Joint Research: 2 results,  Invited: 2 results)

  • [Journal Article] 半導体ウエハへの三次元配線加工:TSVと狭ピッチ電極を中心に2017

    • Author(s)
      福島誉史, 李康旭, 田中徹, 小柳光正
    • Journal Title

      表面技術

      Volume: 67(8) Pages: 410-420

    • NAID

      130005875872

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration2016

    • Author(s)
      Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee , Tetsu Tanaka and Mitsumasa Koyanagi
    • Journal Title

      Micromachines

      Volume: 7 Issue: 10 Pages: 184-184

    • DOI

      10.3390/mi7100184

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Presentation] Transfer and Non-Transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding2016

    • Author(s)
      Takafumi Fukushima, Hideto Hashiguchi, Murugesan Mariappan, Jicheol Bea, Hiroyuki Hashimoto, Hisashi Kino,
    • Organizer
      ECTC: IEEE Electronic Components and Technology Conference
    • Place of Presentation
      USA(Las Vegas)
    • Year and Date
      2016-06-01
    • Related Report
      2015 Research-status Report
    • Int'l Joint Research
  • [Presentation] Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration2016

    • Author(s)
      福島誉史
    • Organizer
      The Electrochemical Society
    • Place of Presentation
      ホノルル(米国)
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] 気相堆積重合によるポリイミド薄膜の形成とシリコン貫通配線への応用2015

    • Author(s)
      福島誉史, マリアッパン ムルゲサン, 裵志哲, 李康旭, 小柳光正
    • Organizer
      第64回高分子討論会
    • Place of Presentation
      宮城県 仙台市 東北大学 川内キャンパス
    • Year and Date
      2015-09-10
    • Related Report
      2015 Research-status Report
  • [Presentation] 高分子材料を用いた三次元集積技術2015

    • Author(s)
      福島誉史
    • Organizer
      第41回YJC実装技術セミナー
    • Place of Presentation
      神奈川県 横浜市 横浜国立大学
    • Year and Date
      2015-06-11
    • Related Report
      2015 Research-status Report
    • Invited

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Published: 2015-04-16   Modified: 2018-03-22  

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