Submicron-scale selective metallization process for 3D integration technology
| Project/Area Number |
17H02769
|
|---|
| Research Category |
Grant-in-Aid for Scientific Research (B)
|
| Allocation Type | Single-year Grants |
|---|
| Section | 一般 |
|---|
| Research Field |
Applied materials
|
|---|
| Research Institution | National Institute for Materials Science |
|---|
Principal Investigator |
MINARI Takeo 国立研究開発法人物質・材料研究機構, 機能性材料研究拠点, 独立研究者 (90443035)
|
|---|
| Project Period (FY) |
2017-04-01 – 2020-03-31
|
| Project Status |
Completed (Fiscal Year 2019)
|
| Budget Amount *help |
¥17,160,000 (Direct Cost: ¥13,200,000、Indirect Cost: ¥3,960,000)
Fiscal Year 2019: ¥3,250,000 (Direct Cost: ¥2,500,000、Indirect Cost: ¥750,000)
Fiscal Year 2018: ¥6,630,000 (Direct Cost: ¥5,100,000、Indirect Cost: ¥1,530,000)
Fiscal Year 2017: ¥7,280,000 (Direct Cost: ¥5,600,000、Indirect Cost: ¥1,680,000)
|
|---|
| Keywords | プリンテッドエレクトロニクス / 無電解めっき / 三次元実装 / 有機トランジスタ / 有機半導体 / 有機半導体デバイス / 表面・界面物性 |
|---|
| Outline of Final Research Achievements |
In this project, we developed "ultrahigh-resolution Printed Electronics" and "selective electroless plating" techniques for realizing a novel 3-dimentional integration technology. Printed Electronics technique using metal nanoparticle ink realized printable interconnections with the line width of 0.8 micrometer. The electroless plating techniques enabled the direct formation of metal interconnections with the line width of 1 micrometer. We also realized the 3-dimensional layer-by-layer stacking process with the connection between each layers through via holes.
|
| Academic Significance and Societal Importance of the Research Achievements |
金属のインクを塗って電子回路を描く「プリンテッドエレクトロニクス」技術と、任意の領域のみを自発的にめっきで金属化する「選択的無電解めっき」技術を開発し、これまでより微細な配線を形成した。さらに配線を三次元的に積層する技術を開発し、複雑な電子回路ができるようになった。
|
Report
(4 results)
Research Products
(60 results)
-
-
-
-
-
-
-
-
-
-
-
-
[Journal Article] Wafer-scale and deterministic patterned growth of monolayer MoS2 via vapor-liquid-solid method2019
Author(s)
S. Li , Y-C. Lin, X-Y. Liu, Z. Hu, J. Wu, H. Nakajima, S. Liu, T. Okazaki, W. Chen, T. Minari, Y. Sakuma, K. Tsukagoshi , K. Suenaga, T. Taniguchi, M. Osada
-
Journal Title
Nanoscale
Volume: 11
Issue: 34
Pages: 16122-16129
DOI
Related Report
Peer Reviewed / Int'l Joint Research
-
-
-
-
-
-
-
[Journal Article] Generating one-dimensional micro- or nano-structures with in-plane alignment by vapor-driven wetting kinetics2017
Author(s)
C. Liu, X. Liu, Y. Xu, H. Sun, Y. Li, Y. Shi, M. V. Lee, T. Yamada, T. Hasegawa, Y.-Y. Noh, T. Minari
-
Journal Title
Materials Horizons
Volume: 4
Issue: 2
Pages: 259-259
DOI
Related Report
Peer Reviewed / Int'l Joint Research
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
