| Project/Area Number |
20560109
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Okayama University |
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Principal Investigator |
OHASHI Kazuhito Okayama University, 大学院・自然科学研究科, 准教授 (10223918)
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| Co-Investigator(Kenkyū-buntansha) |
TSUKAMOTO Shinya 岡山大学, 大学院・自然科学研究科, 教授 (80163773)
長谷川 裕之 岡山大学, 自然科学研究科, 助教 (60403482)
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| Project Period (FY) |
2008 – 2010
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| Project Status |
Completed (Fiscal Year 2010)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2010: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2009: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2008: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
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| Keywords | 切削・研削加工 / マイクロ砥粒加工 / キャビテーション / 砥粒加工 / スラリ / ノズル / CFD / 加工量 / スラリー / 加工精度 / 衝撃力 / 材料除去量 / 表面粗さ |
|---|
| Research Abstract |
The abrasive machining using a cavitation in reversing suction flow, in which slurry squirts against a wafer urface perpendicularly from a restrictor nozzle by suction of slurry in a machining chamber, is formulated in this study. Machining effect in the developed method and suitable machining conditions of quarts wafers are investigated. Wafer surface profile is dominated in several nanometer revel by the nozzle diameter and the nozzle clearance. The form accuracy of wafer surface is improved by addition of rotating mechanism in a wafer setting stage.
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