Influence of base layer thickness in orthodontic adhesive whose bond strength is changed by heating

Research Project

Project/Area Number	20791593
Research Category	Grant-in-Aid for Young Scientists (B)
Allocation Type	Single-year Grants
Research Field	Orthodontic/Pediatric dentistry
Research Institution	Nihon University
Principal Investigator	NAMURA Yasuhiro Nihon University, 歯学部, 助教 (80386078)
Project Period (FY)	2008 – 2009
Project Status	Completed (Fiscal Year 2009)
Budget Amount *help	¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000) Fiscal Year 2009: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000) Fiscal Year 2008: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Keywords	科矯正用接着材 / マイクロカプセル / 歯学 / 歯科矯正用接着材 / 矯正接着材 / 矯正
Research Abstract	We have developed an orthodontic adhesive whose bond strength is markedly decreased by heating and evaluated relationship between thickness and bond strength in the adhesive,Thicknesses of the adhesive (50-200μm) were set and the bond strengths were measured with each thickness.As the results,it was found that the bond strength of l00μm thickness is appropriate and available.In addition,We measured bond strength of existing adhesive using bracket built the adhesive layer and it was confirmed that bonding using a bracket with the layer of 100μm is acceptable.