Dynamic wetting behavior involving recovery of oxide droplet

Research Project

Project/Area Number	20860054
Research Category	Grant-in-Aid for Young Scientists (Start-up)
Allocation Type	Single-year Grants
Research Field	Metal making engineering
Research Institution	Osaka University
Principal Investigator	NAKAMOTO Masashi Osaka University, 工学研究科, 特任助教 (80467539)
Project Period (FY)	2008 – 2009
Project Status	Completed (Fiscal Year 2009)
Budget Amount *help	¥2,561,000 (Direct Cost: ¥1,970,000、Indirect Cost: ¥591,000) Fiscal Year 2009: ¥1,248,000 (Direct Cost: ¥960,000、Indirect Cost: ¥288,000) Fiscal Year 2008: ¥1,313,000 (Direct Cost: ¥1,010,000、Indirect Cost: ¥303,000)
Keywords	界面物性 / 酸化物融体 / 濡れ性 / 界面張力 / 界面反応 / 表面張力
Research Abstract	Dynamic wetting behavior involving recovery of Na_2O-SiO_2 droplet on solid Cu substrate was investigated by conducting wetting experiment with Pt or Au substrate instead of Cu substrate in order to attempt understand the mechanism of the dynamic wetting behavior. The dynamic wetting behavior on Pt or Au substrate was not observed. Thus, it was concluded that the behavior presumably attributes to the variation of interfacial tension between Na_2O-SiO_2 droplet and solid Cu substrate due to the movements of Cu between those two substances.