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Improvement of surface flatness of a workpiece in double-sided polishing processes

Research Project

Project/Area Number 20K14626
Research Category

Grant-in-Aid for Early-Career Scientists

Allocation TypeMulti-year Fund
Review Section Basic Section 18020:Manufacturing and production engineering-related
Research InstitutionOsaka University

Principal Investigator

Satake Urara  大阪大学, 工学研究科, 助教 (70828409)

Project Period (FY) 2020-04-01 – 2022-03-31
Project Status Completed (Fiscal Year 2021)
Budget Amount *help
¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000)
Fiscal Year 2021: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2020: ¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
Keywords研磨加工 / シリコンウェーハ
Outline of Research at the Start

シリコンウェーハの両面研磨加工ではウェーハの高平坦化が最大の課題であるが,これまで多くの理論的検討が行われてきたものの,実験的検証の難しさがネックとなり平坦化理論の構築は進んでいない.本研究では,“実験的に裏付けられた” 平坦化理論を構築することにより,次世代半導体用ウェーハに求められる平坦度の実現を目指す.具体的には,工作物の回転速度が平坦度に及ぼす影響に着目し,「回転速度」,「工具‐工作物間の摩擦状態」および「加工液流れ」の関係を実験的な評価にもとづき明らかにすることで,高平坦化を実現可能な新たな保持具の開発を行う.

Outline of Final Research Achievements

A double-sided polishing process of silicon wafers as semiconductor substrates has serious problems including deterioration in surface flatness of wafers. However, the existing double-sided polishing technologies cannot meet the strict requirements for better surface flatness because the relation between polishing conditions and surface flatness of a finished workpiece remains poorly understood. In this study, we investigated the effect of the rotation speed of a workpiece on the obtained surface flatness. On the basis of the findings, we developed new polishing holders which can achieve better surface flatness.

Academic Significance and Societal Importance of the Research Achievements

本研究では,両面研磨加工において工作物の回転速度が得られる平坦性に及ぼす影響を明らかにした.従来,実験的な検討の難しさから十分な解明がなされてこなかった両面研磨加工中の工作物の回転挙動,およびその挙動が加工結果に及ぼす影響を明らかにした点で学術的意義が高いと言える.また,本研究で示した保持具の設計指針は,シリコンウェーハのみならず,高い平坦性が要求される他の基板材料の両面研磨加工においても適用可能なものであり,その社会的意義も高いと言える.

Report

(3 results)
  • 2021 Annual Research Report   Final Research Report ( PDF )
  • 2020 Research-status Report
  • Research Products

    (6 results)

All 2021 2020

All Journal Article (2 results) (of which Peer Reviewed: 2 results) Presentation (4 results) (of which Int'l Joint Research: 2 results)

  • [Journal Article] Viscoelastic behavior of polishing pad: Effects on edge roll-off during silicon wafer polishing2020

    • Author(s)
      Satake Urara、Harada Sena、Enomoto Toshiyuki
    • Journal Title

      Precision Engineering

      Volume: 62 Pages: 30-39

    • DOI

      10.1016/j.precisioneng.2019.11.005

    • Related Report
      2020 Research-status Report
    • Peer Reviewed
  • [Journal Article] Polishing pad for reducing edge roll-off while maintaining good global flatness of silicon wafer2020

    • Author(s)
      Satake Urara、Matsui Senju、Enomoto Toshiyuki
    • Journal Title

      Precision Engineering

      Volume: 66 Pages: 577-592

    • DOI

      10.1016/j.precisioneng.2020.09.010

    • Related Report
      2020 Research-status Report
    • Peer Reviewed
  • [Presentation] Effects of viscoelastic behavior of polishing pad on edge roll-off during silicon wafer polishing2021

    • Author(s)
      Urara Satake, Toshiyuki Enomoto
    • Organizer
      JSME 2021 Conference on Leading Edge Manufacturing (LEM2021)
    • Related Report
      2021 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 研磨パッドの粘弾性特性がエッジ・ロールオフに及ぼす影響2021

    • Author(s)
      佐竹うらら,榎本俊之
    • Organizer
      2021年度砥粒加工学会学術講演会
    • Related Report
      2021 Annual Research Report
  • [Presentation] Improvement of edge surface flatness in polishing of silicon wafers2020

    • Author(s)
      Matsui Senju、Satake Urara、Enomoto Toshiyuki
    • Organizer
      18th International Conference on Precision Engineering
    • Related Report
      2020 Research-status Report
    • Int'l Joint Research
  • [Presentation] シリコンウェーハの研磨加工におけるエッジ平坦性の向上2020

    • Author(s)
      松井千寿,佐竹うらら,榎本俊之
    • Organizer
      2020年度砥粒加工学会学術講演会
    • Related Report
      2020 Research-status Report

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Published: 2020-04-28   Modified: 2023-01-30  

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