Efficient Modeling and Simulation of 3D Packaging Systems
| Project/Area Number |
21500057
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Computer system/Network
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| Research Institution | Kagawa University |
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Principal Investigator |
TANJI Yuichi 香川大学, 工学部, 准教授 (10306988)
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| Project Period (FY) |
2009 – 2011
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| Project Status |
Completed (Fiscal Year 2011)
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| Budget Amount *help |
¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2011: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000)
Fiscal Year 2010: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
Fiscal Year 2009: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
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| Keywords | 実装 / 3次元 / 集積回路 / シミュレーション / 寄生素子 / 寄生素子抽出 |
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| Research Abstract |
A method for expressing the inductance matrix of multi-conductor system with sparse one was presented in this research. Also, the plane circuit was expressed by a simple equivalent circuit, based on the approximation of Maxwell' s equations. Moreover, a fast algorithm for analyzing the large scale linear networks with CMOS circuits was proposed and the prototype simulator was developed. It is confirmed that the developed simulator is faster than the previous methods. Therefore, this research enables us to model and simulate the 3D packaging systes efficiently.
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Report
(4 results)
Research Products
(19 results)
