| Project/Area Number |
21560128
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Kyushu Institute of Technology |
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Principal Investigator |
NARAHARA Hiroyuki 九州工業大学, 大学院・情報工学研究院, 教授 (80208082)
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| Co-Investigator(Renkei-kenkyūsha) |
SUZUKI Hiroshi 九州工業大学, 大学院・情報工学研究院, 教授 (00144204)
KORESAWA Hiroshi 九州工業大学, 大学院・情報工学研究院, 助教 (70295012)
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| Research Collaborator |
KIKUCHI Satoshi 九州工業大学, 大学院・情報創成専攻
KATO Shota 九州工業大学, 大学院・情報創成専攻
IKEUCHI Takahiro 九州工業大学, 大学院・情報創成専攻
HIRATA Wataru 九州工業大学, 九州工業大学
URAKAWA Yuuki 九州工業大学, 大学院・情報創成専攻
TAKESHITA Sho 九州工業大学, 大学院・情報創成専攻
SHIMOKAWA Yuuki 九州工業大学, 大学院・情報創成専攻
SANEMATSU Hiroaki 九州工業大学, 大学院・情報創成専攻
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| Project Period (FY) |
2009 – 2011
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| Project Status |
Completed (Fiscal Year 2011)
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| Budget Amount *help |
¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2011: ¥130,000 (Direct Cost: ¥100,000、Indirect Cost: ¥30,000)
Fiscal Year 2010: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2009: ¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
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| Keywords | MID / ラピッドプロトタイピング / Additive Manufacturing |
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| Research Abstract |
This study sets realization of the rapid prototyping of functional parts, such as Molded Interconnect Device (MID), as the prospective target by the Additive Fabrication method. This project studies the conductive function using nano-material etc. It turned out by the experiment that it is effective in circuit formation to prevent the silver nano-ink from spreading inside FDM parts by using carbon ink together. In order to realize conductive circuit by an Additive Fabrication method directly, without heat treatment at a furnace, the fundamental experiment for conductive resin was conducted. The discharge from the nozzle of an FDM head was possible for the conductive resin which mixed carbon black to ABS resin. However, it showed the value insufficient for using as a generic electric circuit. The electrical resistivity of the conductive resin mixed solder powder showed sufficient value to use as a generic electric circuit.
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