Research Project
Grant-in-Aid for Research Activity Start-up
Design of circuit architecture and implementation for wirelessly-connected 3D CMOS MEMS integration was performed. The proposed circuit using pulse-based inductive-coupling link can operate even there is large voltage gap between low-voltage CMOS and high-voltage MEMS.
All 2012 2011 2010 Other
All Journal Article (8 results) (of which Peer Reviewed: 8 results) Presentation (22 results)
Journal of Electronic Testing : Theoryand Applications
Volume: vol.28,no.2 Pages: 152-163
Key Engineering Materials
Volume: vol.487 Pages: 285-295
10027975592
IEEE Transactions onVery Large Scale Integration (VLSI) Systems
Volume: vol.19,no.11 Pages: 2058-2066
IEEE Transactions on Very Large ScaleIntegration (VLSI) Systems
Volume: vol.19,no.10 Pages: 1902-1907
Volume: VOL.487 Pages: 285-295
10.4028/www.scientific.net/kem.497.273
Journal of Electronic Testing : Theory and Applications
Volume: (印刷中)
IEEE Transactions on Very Large Scale Integration (VLSI) Systems