Fabrication of new structure transistors using III-V Semiconductors/High-k materials on Si substrates
Project/Area Number |
23560422
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Research Category |
Grant-in-Aid for Scientific Research (C)
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Allocation Type | Multi-year Fund |
Section | 一般 |
Research Field |
Electron device/Electronic equipment
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Research Institution | Osaka Institute of Technology |
Principal Investigator |
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Co-Investigator(Kenkyū-buntansha) |
SASA Shigehiko 大阪工業大学, 工学部, 教授 (50278561)
INOUE Masataka 大阪工業大学, 工学部, 教授 (20029325)
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Project Period (FY) |
2011 – 2013
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Project Status |
Completed (Fiscal Year 2013)
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Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2013: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2012: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2011: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
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Keywords | 化合物半導体 / MOSFET / 半導体ヘテロ構造 / トランジスタ / インジウムヒ素 / 高誘電率ゲート / 高速・低消費電力素子 / InAs / ヘテロ接合トランジスタ / III-V MOSFET / High-kゲート / セルフスイッチングダイオード / 高速・低消費電力 / InAsヘテロ構造 / High-kゲート絶縁膜 |
Research Abstract |
Growth of InAs/AlGaSb heterostructures by molecular beam epitaxy and the characterization of antimonide-based composite-channel InAs MOSFETs are reported. Antimonide-based compound semiconductors such as those of InAs combined with AlGaSb are candidates for high-speed and low-power digital applications. InAs/AlGaSb MOSFETs utilizing high-k (HfO2) gate insulator were fabricated using a Ni/Au ohmic metallization. Low contact resistance using Ni/Au ohmic metal and annealing in N2 for 60 seconds. The transconductance gm of 414 mS/mm was obtained for the MOSFET with gate length of 1um.
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Report
(4 results)
Research Products
(36 results)
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[Presentation] Fabrication and Characterization of Antimonide-Based Composite-Channel InAs/AlGaSb HFETs using High-k Gate Insulator2011
Author(s)
T. Kiso, H.Yoshikawa, Y. Ishibashi, K. Nishisaka, K. Ogata, T. Maemoto, S. Sasa, M. Inoue
Organizer
2011 International Meeting for Future of Electron Devices, Kansai
Place of Presentation
Suita, Osaka, Japan
Year and Date
2011-05-19
Related Report
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