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Application of Time Limited Adhesion by Electrically Dismantlable Adheisves for Separetable laminates

Research Project

Project/Area Number 23656079
Research Category

Grant-in-Aid for Challenging Exploratory Research

Allocation TypeMulti-year Fund
Research Field Materials/Mechanics of materials
Research InstitutionTokyo Institute of Technology

Principal Investigator

SATO CHIAKI  東京工業大学, 精密工学研究所, 准教授 (80235366)

Project Period (FY) 2011 – 2013
Project Status Completed (Fiscal Year 2013)
Budget Amount *help
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2013: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2012: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2011: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
Keywords接着 / リサイクル
Research Abstract

This research has treated an electrically dismantlable adhesive as a material to realize electrically separation laminates that can be separated as we like. In addition, a system by which the joint can be dismantled after long duration was also investigated. The basic properties of the adhesive for separation were experimentally investigated and understood, and it leaded to the confirmation of feasibility for the electrically separation laminates. On the other hand, it was found that the adhesive was difficult to separate with low voltage applied.

Report

(4 results)
  • 2013 Annual Research Report   Final Research Report ( PDF )
  • 2012 Research-status Report
  • 2011 Research-status Report
  • Research Products

    (6 results)

All 2013 2012 2011 Other

All Presentation (6 results)

  • [Presentation] Separation Properties of joints bonded with electrically dismantlable adhesive2013

    • Author(s)
      C. Sato
    • Organizer
      2nd International Conference on Structural Adhesive Bonding
    • Place of Presentation
      Porto University, Porto, Portugal
    • Year and Date
      2013-07-04
    • Related Report
      2013 Final Research Report
  • [Presentation] Separation Properties of joints bonded with electrically dismantlable adhesive2013

    • Author(s)
      Chiaki Sato
    • Organizer
      2nd International Conference on Structural Adhesive Bonding
    • Place of Presentation
      Porto, Portugal
    • Related Report
      2013 Annual Research Report
  • [Presentation] Properties of Resins for Adhesive in Hot-wet conditions2012

    • Author(s)
      Y. Kurata, C. Sato, K. Wakabayashi, S. Kondo and T. Aoki
    • Organizer
      ASMP 2012
    • Place of Presentation
      IIT Madoras, Chennai, India
    • Year and Date
      2012-08-20
    • Related Report
      2013 Final Research Report
  • [Presentation] Mechanical Separation Properties of Electrically Dismantlable Adhesives2011

    • Author(s)
      C. Sato, H HSiote and M. Ohe
    • Organizer
      Adhesion 11
    • Place of Presentation
      York University, York, UK
    • Year and Date
      2011-09-08
    • Related Report
      2013 Final Research Report
  • [Presentation] Mechanical and Separation Properties of Electrically Dismantlable Adhesives2011

    • Author(s)
      Chiaki Sato, Hidenao SHIOTE, Manabu OHE
    • Organizer
      Adhesion'11
    • Place of Presentation
      National Science Learning Centre, University of York, York, UK
    • Related Report
      2011 Research-status Report
  • [Presentation] Properties of Resins for Adhesive in Hot-wet conditions

    • Author(s)
      Y. Kurata, C. Sato, K. Wakabayashi, S. Kondo, T. Aoki
    • Organizer
      ASMP 2012
    • Place of Presentation
      IIT Madoras, Chennai, India
    • Related Report
      2012 Research-status Report

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Published: 2011-08-05   Modified: 2019-07-29  

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