Research Project
Grant-in-Aid for Young Scientists (B)
Fabrication process of Cu and Ni nanoparticles by electroless plating method were developed. The size of the nanoparticles was controlled by controlling the plating conditions. When alumina particle reinforcements modified by Cu nanoparticles were heat-treated, the Cu nanoparticles were changed to CuO nanoparticles. Al alloy melt was infiltrated spontaneously into the alumina particle layer modified by CuO nanoparticles due to the thermite process resulting the improvement of the wettability between alumina and Al alloy melt. It is suggested that Cu nanopartiles having high specific surface area would be oxidized and reacted with Al alloy melt easily and resulted in the spontaneous infiltration.
All 2012 2011 Other
All Presentation (16 results)
