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Study on a substrate for ultra high density power supply on chip

Research Project

Project/Area Number 24360111
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypePartial Multi-year Fund
Section一般
Research Field Power engineering/Power conversion/Electric machinery
Research InstitutionKyushu Institute of Technology

Principal Investigator

Matsumoto Satoshi  九州工業大学, 大学院工学研究院, 教授 (10577282)

Co-Investigator(Kenkyū-buntansha) SHINKAI Shinichi  九州工業大学, マイクロ化総合技術センター, 准教授 (90374785)
NISHIZAWA Shinichi  産業技術総合研究所, エネルギー技術部門, グループリーダー (40267414)
BABA Akiyoshi  九州工業大学, マイクロ化総合技術センター, 准教授 (80304872)
Project Period (FY) 2012-04-01 – 2016-03-31
Project Status Completed (Fiscal Year 2015)
Budget Amount *help
¥18,590,000 (Direct Cost: ¥14,300,000、Indirect Cost: ¥4,290,000)
Fiscal Year 2014: ¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2013: ¥6,240,000 (Direct Cost: ¥4,800,000、Indirect Cost: ¥1,440,000)
Fiscal Year 2012: ¥6,890,000 (Direct Cost: ¥5,300,000、Indirect Cost: ¥1,590,000)
Keywords集積化電源 / Si on Diamond / 排熱 / 抜熱 / SOD基板 / ウエハー接合技術 / パワーSoC / SOD / パワーIC / DC-DCコンバータ / 集積化パワーシステム / パワーSOC / パワーMOSFET / 高温動作 / 実装
Outline of Final Research Achievements

R&D trend for the power supply is how to reduce the volume and power SoC(Supply on Chip) is attracted attentions of many researchers because it can ultimate miniaturization of the power supply. To increase the switching frequency of power supply is one of the promising candidates to reduce the size of power supply. On the other hand, to reduce the size of power supply has a limitation because of self heating. SOI(Silicon on Insulator) substrate is suitable for high frequency switching because of minimization of the parasitic capacitance however it has a problem of self heating because small thermal conductivity of the buried SiO2 layer.
In this study, we propose the SOD(silicon on Diamond) substrate which has larger thermal conductivity of the diamond film used as a buried insulator layer and fabrication process of it. In addition, we also report the impact of SOD substrate as a counter part of SOI substrate.

Report

(5 results)
  • 2015 Annual Research Report   Final Research Report ( PDF )
  • 2014 Annual Research Report
  • 2013 Annual Research Report
  • 2012 Annual Research Report
  • Research Products

    (13 results)

All 2015 2014 2012 Other

All Journal Article (2 results) (of which Peer Reviewed: 2 results) Presentation (11 results) (of which Int'l Joint Research: 2 results,  Invited: 2 results)

  • [Journal Article] Impact of silicon on diamond structure for power-supply on chip applications2014

    • Author(s)
      K. Nakagawa, T. Kodama, S. Matsumoto, T. Yamada, M. Hasegawa, and S. Nishizawa
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 53 Issue: 4S Pages: 04DP09-04DP09

    • DOI

      10.7567/jjap.54.04dp09

    • Related Report
      2015 Annual Research Report 2014 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Impact of Silicon on Diamond Structure for Power-Supply on Chip Application2014

    • Author(s)
      K. Nakagawa, T. Kodama, S. Matsumoto, T. Yamada, M. Hasegawa, and S. Nishizawa
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 53 Issue: 4S Pages: 1-4

    • DOI

      10.7567/jjap.53.04ep16

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Presentation] “The Heat Performance Study of Nanocrystal Diamond Film Used in a Thin Film Device”,2015

    • Author(s)
      S. Duangchan, U. Koshikawa, R. Shirahama, K.Oishi, A. Baba, S. Matsumoto, and M.Hasagawa,
    • Organizer
      International Conference on Solid State Devices and Materials 2015
    • Place of Presentation
      Saporo, Japan
    • Year and Date
      2015-09-27
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] The Silicon on Diamond Structure by low temperature bonding technique2015

    • Author(s)
      S. Duangchan, U. Uchikawa, U. Koshikawa, A. baba, K. Nakagawa, S.Matsumoto, M.Hasagawa, and S.Nishizawa
    • Organizer
      IEEE Electric Components and Technology Conference 2015 (ECTC2015)
    • Place of Presentation
      San Diego, USA
    • Year and Date
      2015-05-26
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Numerical evaluations of a new 3D stacking structure for power supply on chip2014

    • Author(s)
      W. Yoshida, K. Nakagawa, S, Matsumoto, T. Yamada, and M. Hasegawa
    • Organizer
      International Power Supply on Chip Workshop 2014
    • Place of Presentation
      Boston アメリカ
    • Year and Date
      2014-10-08
    • Related Report
      2014 Annual Research Report
  • [Presentation] Impact of the silicon on diamond structure for high temperature switching applications2014

    • Author(s)
      H. Kanoya K. Nakagawa, and S. Matsumoto
    • Organizer
      2014 Solid State Devices & Materials
    • Place of Presentation
      Tsukuba
    • Year and Date
      2014-09-08 – 2014-09-11
    • Related Report
      2014 Annual Research Report
  • [Presentation] Numerical predict ions of a new SOI structure using thin-diamond film used as insulator2012

    • Author(s)
      T. Kodama, S. Matsumoto, T. Yamada, M. Hasegawa, and S. Nishizawa
    • Organizer
      International Workshop on Power Supply on Chip
    • Place of Presentation
      San Francisco
    • Year and Date
      2012-11-16
    • Related Report
      2012 Annual Research Report
  • [Presentation] ダイヤモンド薄膜を絶縁膜として用いたパワーSOC用SOI基板のシミュレーションによる検討2012

    • Author(s)
      児玉拓也、松本 聡、 西澤伸一
    • Organizer
      電気学会電子デバイス・半導体電力変換合同研究会
    • Place of Presentation
      浜松
    • Year and Date
      2012-10-26
    • Related Report
      2012 Annual Research Report
  • [Presentation] 私達の生活を支えるエレクトロニクス材料

    • Author(s)
      西澤伸一
    • Organizer
      第165回ICSEADアジア講座
    • Place of Presentation
      北九州
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] パワーSoC(Supply on Chip)実現に向けてのプラットフォーム技術

    • Author(s)
      松本 聡
    • Organizer
      STARCワークショップ2013
    • Place of Presentation
      新横浜
    • Related Report
      2013 Annual Research Report
  • [Presentation] Impact of Silicon on Diamond Structure for Power-Supply on Chip Applications

    • Author(s)
      K. Nakagawa, T. Kodama, S. Matsumoto, T. Yamada, M. Hasegawa, and S. Nishizawa
    • Organizer
      2013 Solid State Devices & Materials
    • Place of Presentation
      福岡
    • Related Report
      2013 Annual Research Report
  • [Presentation] SOIパワーMOSFETの高温動作特性

    • Author(s)
      石橋 翼 松本 聡
    • Organizer
      電気学会 電子デバイス・半導体電力変換合同研究会
    • Place of Presentation
      大阪大学
    • Related Report
      2013 Annual Research Report
  • [Presentation] Wafer technology for future power device

    • Author(s)
      S.Nishizawa
    • Organizer
      7TH INTERNATIONAL WORKSHOP ON THE PHYSICS OF SEMICONDUCTOR DEVICES
    • Place of Presentation
      Delhi
    • Related Report
      2013 Annual Research Report
    • Invited

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Published: 2012-04-24   Modified: 2019-07-29  

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