Elucidation of Mechanism of critical heat flux for single boiling bubble condition by using Micro Electro Mechanical System technology
| Project/Area Number |
24560241
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Thermal engineering
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| Research Institution | Kogakuin University |
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Principal Investigator |
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| Project Period (FY) |
2012-04-01 – 2015-03-31
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| Project Status |
Completed (Fiscal Year 2014)
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| Budget Amount *help |
¥5,330,000 (Direct Cost: ¥4,100,000、Indirect Cost: ¥1,230,000)
Fiscal Year 2014: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2013: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2012: ¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
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| Keywords | 熱工学 / 沸騰 / 限界熱流束 / 核沸騰 / MEMS / キャビティ / 気泡 / 伝熱促進 / シリコンウエハー / 赤外線放射温度計 |
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| Outline of Final Research Achievements |
In order to elucidation of mechanism of critical heat flux, the present research investigated mechanism of critical heat flux for single boiling bubble condition and enhancement of boiling heat transfer by using Micro Electro Mechanical System technology. Steady state pool boiling experiments were conducted by using a copper thin film for the test heater and pure water at some pressure conditions. The system pressure was 0.01 and 0.10 MPa, respectively. The heaters were made of a printed circuit board and a silicon wafer with sputtering copper film.
The mechanism of critical heat flux on a single boiling bubble was examined through observations at 4000 flames/s by using a high speed video camera and two dimensional temperature field measurements at 200 Hz by using an infrared thermometer. Furthermore, boiling heat transfer was enhanced by using copper film heater bonded a small chip of silicon wafer: the enhanced ratio was about four.
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Report
(4 results)
Research Products
(15 results)
