| Project/Area Number |
24656008
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Single-year Grants |
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| Research Field |
Applied materials science/Crystal engineering
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| Research Institution | Chiba University |
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Principal Investigator |
KUDO Kazuhiro 千葉大学, 工学(系)研究科(研究院), 教授 (10195456)
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| Co-Investigator(Kenkyū-buntansha) |
SAKAI Masatoshi 千葉大学, 大学院工学研究科, 准教授 (60332219)
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| Project Period (FY) |
2012-04-01 – 2014-03-31
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| Project Status |
Completed (Fiscal Year 2013)
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| Budget Amount *help |
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2013: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2012: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
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| Keywords | 無溶媒印刷プロセス / 超音波融着 / ラミネートプロセス / 薄膜トランジスタ / 有機半導体 / 無溶媒印刷 / 熱プレス / 薄膜デバイス |
|---|
| Research Abstract |
A novel printing process using ultrasonic welding technique has been developed in this research work. Organic semiconductor materials were placed between two plastic films with transistor electrodes, and ultrasonic vibration was applied on the sample. Instantaneous and local heating generated by the ultrasonic welding equipment make the semiconductor material melt. As a result, organic thin film transistors were fabricated between the flexible films. The proposed ultrasonic welding technique is solvent-free process and green technology compared with other printing processes. This method is applicable to low heat resistant plastic materials as a substrate film.
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