Low strain and high aspect ratio Cu-TSVs
| Project/Area Number |
25289258
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Partial Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Material processing/Microstructural control engineering
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| Research Institution | Ibaraki University |
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Principal Investigator |
Onuki Jin 茨城大学, 理工学研究科, 特任教授 (70315612)
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| Co-Investigator(Kenkyū-buntansha) |
Inami Takashi 茨城大学, 工学部, 准教授 (20091853)
Kondo Kazuo 大阪府立大学, 大学院工学研究科, 教授 (50250478)
Nagano Takatoshi 茨城大学, 工学部, 講師 (70343621)
篠嶋 妥 茨城大学, 工学部, 教授 (80187137)
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| Project Period (FY) |
2013-04-01 – 2016-03-31
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| Project Status |
Completed (Fiscal Year 2015)
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| Budget Amount *help |
¥18,590,000 (Direct Cost: ¥14,300,000、Indirect Cost: ¥4,290,000)
Fiscal Year 2015: ¥5,330,000 (Direct Cost: ¥4,100,000、Indirect Cost: ¥1,230,000)
Fiscal Year 2014: ¥5,200,000 (Direct Cost: ¥4,000,000、Indirect Cost: ¥1,200,000)
Fiscal Year 2013: ¥8,060,000 (Direct Cost: ¥6,200,000、Indirect Cost: ¥1,860,000)
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| Keywords | Cu-TSV / ３次元実装 / 低抗率 / Cuめっき / 不純物 / 3次元実装 / 抵抗率 / 結晶粒径 / 化合物 / 低歪 / TSV / 低ひずみ |
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| Outline of Final Research Achievements |
We manufactured a new TEG patterns, and evaluated the resistivity and nano-microstructures of Cu-TSVs. Following results were obtained.1)Resistivity of Cu-TSVs was found to be 4.13μΩ・cm. 2)Existence ration of small grains less than 50nm was also found by X-ray diffraction and EBSD analysis.3)Impurities consisting of Cl,O, and metal elements were found in nano-grain boundaries by STEM. The impurities prevented grain growth during annnealing.
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Report
(4 results)
Research Products
(11 results)
