Thermally Stable Thin Polymeric Multi-Layer Fromation with ALD
Project/Area Number |
25630118
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Research Category |
Grant-in-Aid for Challenging Exploratory Research
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Allocation Type | Multi-year Fund |
Research Field |
Electronic materials/Electric materials
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Research Institution | Tohoku University |
Principal Investigator |
FUKUSHIMA Takafumi 東北大学, 未来科学技術共同研究センター, 准教授 (10374969)
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Co-Investigator(Kenkyū-buntansha) |
MARIAPPAN Murugesan 東北大学, 未来科学技術共同研究センター, 産学官連携研究員 (10509699)
BEA Jichel 東北大学, 未来科学技術共同研究センター, 助教 (40509874)
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Project Period (FY) |
2013-04-01 – 2015-03-31
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Project Status |
Completed (Fiscal Year 2014)
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Budget Amount *help |
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2014: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2013: ¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
|
Keywords | 気相堆積重合 / ポリイミド / TSV / TSV |
Outline of Final Research Achievements |
A novel approach to suppress the conventional Cu-TSV induced thermo-mechanical stress in 3D-LSI chip is proposed, fabricated and tested. In this approach, a thermal-chemical-vapor-deposition grown organic polyimide is conformably deposited along the side wall of the TSV. Compared to ALD, the thickness controllability is not so high, but relatively high thickness control with a resolution of 10 nm in thickness is realized. The deposition rate is approximately 100-200nm/min. The step-coverage is approximately 80% for high-aspect-ratio TSV with the depth of 50 um and the diameter of 5 um, and the resulting polyimide thin layer is very pure and shows high thermal stability. As-grown polymer was evaluated for their role in minimizing the thermo-mechanical stress in vicinal and via-space Si. It was found that replacing the conventional SiO2 dielectric liner with organic polymer greatly helps in suppressing the thermo-mechanical stress.
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Report
(3 results)
Research Products
(9 results)
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[Presentation] Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits2014
Author(s)
Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
Organizer
the 64th Electronic Components and Technology Conference (ECTC)
Place of Presentation
Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Orlando, Florida, USA
Year and Date
2014-05-27 – 2014-05-30
Related Report
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