Study on mirror surface slicing of electronic element materials by multi-wire saw
| Project/Area Number |
26420061
|
|---|
| Research Category |
Grant-in-Aid for Scientific Research (C)
|
| Allocation Type | Multi-year Fund |
|---|
| Section | 一般 |
|---|
| Research Field |
Production engineering/Processing studies
|
|---|
| Research Institution | Kanazawa Institute of Technology |
|---|
Principal Investigator |
|
|---|
| Project Period (FY) |
2014-04-01 – 2017-03-31
|
| Project Status |
Completed (Fiscal Year 2016)
|
| Budget Amount *help |
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2016: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2015: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2014: ¥2,990,000 (Direct Cost: ¥2,300,000、Indirect Cost: ¥690,000)
|
|---|
| Keywords | スライシング / マルチワイヤソー / Si / SiC / 鏡面加工 / 延性モード加工 / 切削・研削加工 / スライシング加工 / 遊離砥粒 |
|---|
| Outline of Final Research Achievements |
The multi-wire has two type of the slicing methods to be called a free abrasive method, a fixed abrasive method. In the recent years, the multi-wire saw that slices the silicon or the silicon carbide using the slurry suspended diamond abrasive grains and wire tool covered by special resin is developed. Therefore, this application was clear the relation between the slicing characteristics of efficiency or accuracy and the influence factor of slicing conditions. And, the results of this application showed the possibility of high slicing efficiency to reduce the slicing cost or the calf-loss.
|
Report
(4 results)
Research Products
(18 results)
