Study on Deposition Mechanism of Contamination and Its Influences on Thermal Resistance at Liquid-Solid Interface
| Project/Area Number |
26630065
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Thermal engineering
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| Research Institution | Osaka University |
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Principal Investigator |
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| Project Period (FY) |
2014-04-01 – 2016-03-31
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| Project Status |
Completed (Fiscal Year 2015)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2015: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2014: ¥3,250,000 (Direct Cost: ¥2,500,000、Indirect Cost: ¥750,000)
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| Keywords | ナノマイクロ熱工学 / 固液界面熱抵抗 / 界面の汚れ / 固液界面 / 界面熱抵抗 |
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| Outline of Final Research Achievements |
In the present study, wall contamination on a heat transfer surface is considered a process of fine particle accumulation on the heat transfer surface. The final scope of the present study is to build a physical model where contamination accumulated on the solid-liquid interface affects the interfacial thermal resistance. An experiment is performed to evaluate the interfacial thermal resistance with and without nanoparticle accumulation. In addition, molecular dynamics simulations are performed to numerically investigate the interfacial thermal resistance. Experimental results are consistent with results of the molecular dynamics simulations. Based on those results, deeper understanding of the interfacial thermal resistance with the contamination particles on the interface is obtained.
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Report
(3 results)
Research Products
(8 results)
