Fine metal patterning on polymer surfaces based on maskless evaporation
Project/Area Number |
26630349
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Research Category |
Grant-in-Aid for Challenging Exploratory Research
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Allocation Type | Multi-year Fund |
Research Field |
Structural/Functional materials
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Research Institution | Osaka Kyoiku University |
Principal Investigator |
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Project Period (FY) |
2014-04-01 – 2016-03-31
|
Project Status |
Completed (Fiscal Year 2015)
|
Budget Amount *help |
¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
Fiscal Year 2015: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2014: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
|
Keywords | 高分子 / 金属蒸着 / 表面ガラス転移点 / 溶媒 / 金属蒸着選択性 / 真空蒸着 / 表面 / 金属パターニング / ガラス転移点 / 有機溶媒 |
Outline of Final Research Achievements |
We have developed a novel metal patterning method based on solvent evaporation from polymer surfaces and maskless metal-vapor deposition. Solvent evaporation generates active surface polymer-chain motion and results in metal-atom desorption from the surface. This method can be applied to several kinds of metal species and typical polymer semiconductive materials. Fine metal pattern around 10 micron was also demonstrated. This suggests that fine metal electrode patterning using a simple process based on this method and would enable a large integration of polymer electronics devices.
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Report
(3 results)
Research Products
(38 results)