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1997 Fiscal Year Final Research Report Summary

Development of Directionally Aligned SiC Whisker Grinding Wheel

Research Project

Project/Area Number 08455074
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field 機械工作・生産工学
Research InstitutionNagoya University

Principal Investigator

YAMAGUCHI Katusmi  Dept.of Mechanical Engineering, Nagoya University, Professor, 工学研究科, 教授 (40023056)

Co-Investigator(Kenkyū-buntansha) HORAGUCHI Iwao  Toyota College of Technology, Associate Professor, 機械工学科, 助教授 (20110182)
SAKAI Katsuhiko  Dept.of Mechanical Engineering, Nagoya University, Research Associate, 工学研究科, 助手 (80262856)
NAKAMOTO Takeshi  Dept.of Mechanical Engineering, Nagoya University, Associate Professor, 工学研究科, 助教授 (30198262)
Project Period (FY) 1996 – 1997
KeywordsSiC whisker / Directional alignment / Grinding wheel / Grinding ratio / Lapping / Sistered diamond / Tool wear / Fatigue wear
Research Abstract

Grinding wheel made of the directionally aligned SiC whiskers was produced and its grinding characteristics were examined.
Grinding characteristics of the resinoid, vitrified, metal and glass bonded wheels were tested and it was clarified that the resinoid wheel showed the best performance in the surface finish. Next, the authors succeeded in developing a loading free-grinding method in which free grains were mixed with grinding fluid, and overcoming a weak point of SiC whisker wheel. Futhermore, these wheel was applied to the lapping process, and very smooth surfaces of the hardened die steel and Si wafer were obtained.
In addition to these experiments, tool wear were investigated in cutting the resinoid wheel. As the results, the effect of whisker size, shape and orientation on the tool wear were made clear and new model of wear mechanism due to fatigue was proposed.

  • Research Products

    (12 results)

All Other

All Publications (12 results)

  • [Publications] JED.Afaghani: "Teat-off Wear Mechanism of Sintered Diamond Tool in Cutting SiC Particle StrengthendEpoxy Composite" Wear. 206. 221-229 (1997)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] K.Yamaguchi: "Grinding with Directionally Aligned SiC Whisker Wheel (Loading-Free Grinding)" American Society for Precision Engineering 12th Annual Meeting. 16. 258-261 (1997)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] K.Yamaguchi: "Wear of Sintered Diamond Tool in Cutting SiC Whisker-Reinforced Plastic Composite" Proc.of the 1st Int.Conf.on Tribology in Manufacturing Processing. 242-247 (1997)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] 洞口 巌: "炭化けい素ウィスカ-ラップ砥石による加工" 砥粒加工学会誌. 41・11. 428-433 (1997)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] 山口 勝美: "方位配列炭化ケイ素ウィスカ-砥石の研磨特性" ニューセラミックス. 11. 7-11 (1997)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] I.Horaguchi: "Surface Finishing Process using Directionally Aligned SiC Whisker Lap" ICPE '97TAIPE,TAIWAN Int.Conf.on Precision Engineering. 437-442 (1997)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] JED.Afaghani: "Teat-off Wear Mechanism of Sistered Diamond Tool in Cutting SiC Particle Strengthend Epoxy Composite" Wear. Vol.206. 221-229 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] K.Yamaguchi: "Grinding with Directionally Aligned SiC Whisker Wheel (Loading-Free Grinding)" American Society for Precision Engineering 12th Annual Meeting. Vol.16. 258-261 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] K.Yamaguchi: "Wear of Sistered Diamond Tool in Cutting SiC Whisker-Reinforced Plastic Composite" Proc.of the 1st International Conference on Tribology in Manufacturing Processing. 242-247 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] I.Horaguchi: "Surface Finishing Process using Directionally Aligned SiC Whisker Lap (in Japanese)" Journal of Society of Gringing Engineers. Vol.41.No.11. 428-433 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] K.Yamaguchi: "Grinding Characteristics of Directionally Aligned SiC whisker Grinding Wheel (in japanese)" New Ceramics. vol.11. 7-11 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] I.Horaguchi: "Surface Finishing Process using Directionally Aligned SiC Whisker Lap" ICPE'97 TAIPEI,TAIWAN International Conference on Precision Engineering. 437-442 (1997)

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 1999-03-16  

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