量子剥離超薄片化装置の開発

2002 Fiscal Year Annual Research Report

• Project/Area Number: 12355024
• Research Institution: The University of Tokyo
• Principal Investigator: 市野瀬 英喜 東京大学, 大学院・工学系研究科, 助教授 (30159842)
• Co-Investigator(Kenkyū-buntansha): 岩本 知広 東京大学, 工学部附属総合試験所, 助手 (60311635) ; 幾原 雄一 東京大学, 工学部附属総合試験所, 助教授 (70192474) ; 須賀 唯知 東京大学, 先端科学技術研究センター, 教授 (40175401)
• Keywords: レーザーガン / 量子効果原子剥離 / 無損傷超薄片 / 紫外域レーザー / 平滑表面 / 電子顕微鏡観察用超薄片 / 原子構造評価技術 / 同調照射

Research Abstract

高速イオンの代わりにエネルギー分散の小さい、短波長の電磁波を用い、最適波長を選んで物質の結合エネルギーに同調照射させることによって、物質に損傷を与えることなく原子間結合を切断し、表面傍の原子を順次剥離することをめざし、すでにシリコンにおいて平滑な表面を持ち格子欠陥を殆ど生成しない理想的な電子顕微鏡観察用超簿片を作製することに成功した。本技術の実用化により、電子顕微鏡情報を「損傷を伴った偽情報の疑惑」から解放し、原子構造情報の質と信頼度を格段に向上させ、電子デバイスの開発、設計、製造の各過程などを、いわばメクラ撃ち手探り状態から解放し、ひいては、現在米国に独占されている、薄片化技術を逆に我々が独占することをねらうものである。昨年までに、レーザーパワーの超精密制御系と微小領域への精密照射光学系の開発、適用物質範囲の拡大は、相当の進展を見た。即ち、(1)イオンガンとレーザーガン両備量子効果原子剥離反応薄片化研究機システムを構築した。これを用いて、下の実験を通してエネルギー密度や光学パラメータの最適のデータを収集できた。(2)λ=193ナノメートルにレーザー波長を固定して、シリコンカーバイド(2原子共有結合物質)、ダイヤモンド(単原子共有結合物質)、について薄片化速度を検証し既知のシリコンと比較検討し、最適な条件を、パルス幅、エネルギー密度、照射回数、について絞り込むことができた。
今年度はさらに進み、(3)表面から飛散する原子が一つずつ飛び出しているのか、集団で飛び出しているのか、そうだとすれば原子集団の規模はどの程度かという、表面性状に直接関わる詳細な情報の収集を始めた。(4)これと並行して、製品につながるプロトタイプの設計が終了した。最終年度(次年度)にはプロトタイプができあがる。

Research Products

• [Publications] E.Takuma, H.Ichinose: "Atomic site determination of a high-pulity SiC grain boundary"Phil. Mag.. 82. 857-866 (2002)
• [Publications] E.Takuma, H.Ichinose: "Chemical Structure Analysis of a Σ9 Grain Boundary in SiC"MRS Symp. Proc. 727. 53-58 (2002)
• [Publications] E.Takuma, H.Ichinose, F-R.Chen: "Atomic structure observation of silicon carbide using HRTEM"J. Electron Microscopy. 51. 297-302 (2002)
• [Publications] E.Takuma, H.Ichinose, S.Sanorpim, K.Onabe: "Morphology and Atomic Structure of Grain Boundaries in GaN grown by MOVPE"MRS Symp. Proc.. 727. 117-122 (2002)
• [Publications] H.Ichinose, H.Sawada, E.Takuma: "HRTEM and EELS analysis of Diamond and Silicon Carbide Grain Boundary"Ann Chim Sci Mat. 27s1. 15-20 (2002)
• [Publications] H.Sawada, H.Ichinose, M.Kohyama: "Imaging of a single atomic column in silicon grain boundary"J. Electron Microscopy. 51. 353-358 (2002)
• [Publications] J.Y.Yan, H.lchinose, Fu-Rong Chen, J.J.Kai, E.Takuma: "Atomic and Electronic Structure of Interfaces at SiC Studied by lndirect Super HRTEM and Electron Spectroscopy"MRS Symp. Proc.. 727. 169-176 (2002)
• [Publications] S.Sanorpim, E.Takuma, R.Katayama, K.Onabe, H.Ichinose, Y.Shirakawa: "Reduction of Plannar Defect Density in Laterally Overgrown Cubic-GaN on Patterned GaAs(001)Substarates by MOVPE"Phys. Stat. Sol.. 234. 840-844 (2002)
• [Publications] S.Sanorpim, E.Takuma, H.Ichinose, Y.Shiraki: "Laterally Overgrown GaN on Patterned GaAs(001)Substrates by MOVPE"Phys. Stat. Sol.. 192. 446-452 (2002)
• [Publications] A.Kimura, Y.Azuma, T.Suzuki, T.Saito, Y.Ikuhara: "Microstructure of diamond-like carbon films prepared by cathodic arc deposition"Dia. Rel. Mater.. 11. 1436-1440 (2002)
• [Publications] Hidehiro Yoshida, Yuichi Ikuhara, Taketo Sakuma: "Grain boundary electronic structure related to the high-temperature creep resistance in polycrystalline Al_2O_3"Acta. Material.. 50. 2955-2966 (2002)
• [Publications] A.Kuwabam, J.Katamura, Y.Ikuhara, T.Sakuma: "Influence of Interaction between Neighboring Oxygen Ions on Phase Stability in Cubic Zirconia"J. Am. Ceram. Soc.. 85. 2557-2561 (2002)
• [Publications] T.Araki, T.Niwa, Y.Yamada, I.Hirabayashi, J.Shibata, Y.Ikuhara, K.Kato, T.Kato, T.Hirayama: "Growth model and the effect of CuO nanocrystallites on the properties of chemically derived epitaxial thin film of YBa_2Cu_3O_<7-x>"J. Appl. Phys. 92. 6. 3318-3325 (2002)
• [Publications] Y.Sato, F.Oba, T.Yamamoto, Y.Ikuhara, T.Sakuma: "Current-Voltage Characteristic across[0001]Twist Boundaries in Zinc Oxide Bicrystals"J. Am. Ceram. Soc.. 85. 2142-2144 (2002)
• [Publications] N.Shibata, F.Oba, T.Yamamoto, Y.Ikuhara, T.Sakuma: "Atomic structure and solute segregation of a・=3[110]/{111}grain boundary in an yttria-stabilized cubic zirconia bicrystal"Phil. Mag. Let.. 82. 393-400 (2002)
• [Publications] H.Yoshida, T.Yamamoto, Y.Ikuhara, T.Sakuma: "A change in the chemical bonding strength and high-temperature creep resistance in Al_2O_3 with lanthanoid oxide doping"Phil. Mag. A.. 82. 511-525 (2002)
• [Publications] K.Sasaki, M.Nakano, Y.Ikuhara, T.Sakuma: "Pre-holed tensile specimens for superplastic Y-TZP ceramics"J. Mater. Sci.. 37. 3307-3313 (2002)
• [Publications] Fumiyasu Oba, Takahisa Yamamoto, Yuichi Ikuhara, Isao Tanaka, Hirohiko Adachi: "First-Principles Calculation of Impurities and Native Defects in ZnO"Mater. Trans.. 43. 1439-1443 (2002)
• [Publications] Katsuyuki Matsunaga, Yuji Iwamoto, Yuichi Ikuhara: "Atomic Structure and Diffusion in Amorphous Si-B-C-N by Molecular Dynamics Simulation"Mater. Trans.. 43. 1506-1511 (2002)
• [Publications] Junko Shibata, Hironori Yamamoto, Sergei A.kulinich, Takahisa Yamamoto, Kazuo Terashima, Toyonobu Yoshida, Yuichi Ikuhara: "Transmission Electron Microscopic Studies of LiNb_<0.5>Ta_<0.5>O_3 Films Deposited on Sapphire Substrates by Thermal Plasma Spray CVD(Microstructure of LiNb_<0.5>Ta_<0.5>O_3 Films Deposited on Sapphire Substrates by Thermal Plasma Spray CVD)"Mater. Trans.. 43. 1512-1516 (2002)
• [Publications] Takahisa Yamamoto, Fumiyasu Oba, Yuichi Ikuhara, Taketo Sakuma: "Current-Voltage Characteristics Across Small Angle Symmetric Tilt Boundaries in Nb-Doped SrTiO_3 Bicrystals"Mater. Trans.. 43. 1537-1541 (2002)
• [Publications] Hitoshi Nishimura, Yuichi Ikuhara, Ken'ichi Ota, Giuseppe Pezotti: "Internal Friction Analysis of CaO-Doped Silicon Carbides"Mater. Trans.. 43. 1552-1556 (2002)
• [Publications] Kazumi Nakagawa, Giuseppe Pezotti, Ken'ichi Ota, Yuichi Ikuhara, Hidehiro Yoshida, Taketo Sakkuma: "Internal Friction Behavior of Alumina Polycrystals with Engineered Grain Boundaries"Mater. Trans.. 43. 1557-1560 (2002)
• [Publications] Tsuyoshi Watanabe, Hidehiro Yoshida, Yuichi Ikuhara, Tateto Sakuma, Hiroyuki Muto, Mototsugu Sasaki: "Grain Boundary Sliding and Atomic Structures in Alumina Bicrystals with[0001] Symmetric Tilt Grain Boundaries"Mater. Trans.. 43. 1561-1565 (2002)
• [Publications] Hidehiro Yoshida, Yorinobu Takigawa, Yuichi Ikuhara, Taketo Sakuma: "Effect of Chemical Bonding State on High-temperature Plastic Flow Behavior in Fine-grained, Polycrystalline Cation-doped Al_2O_3"Mater. Trans.. 43. 1566-1572 (2002)
• [Publications] T.Akhadejdamrong, A.Mitsuo, C.Iwamoto, T.Yamamoto, Y.Ikuhara, T.Aizawa: "Formation of Protection Layer during Oxidation of Al-implanted TiN Coating"Mater. Trans.. 43. 1291-1297 (2002)
• [Publications] Yuichi Ikuhara: "Towards New Transmission Electron Microscopy in Advanced Ceramics"J. Ceram. Soc. Jpn.. 110. 139-145 (2002)
• [Publications] G-D.Zhan, Y.Ikuhara, M.Mitomo, R-J.Xie, T.Sakuma, A.K.Mukherjee: "Microstructural Analysis of liquid-phase-sintered・-SiC"J. Am. Ceram. Soc.. 85. 430-436 (2002)
• [Publications] A.Nakamura, T.Yamamoto, Y.Ikuhara: "Direct Observation of Basal Dislocation in Sapphire by HRTEM"Acta. Mater.. 50[1]. 101-108 (2002)
• [Publications] ZL.Hong, H.Yoshida, Y.Ikuhara, T.Sakuma, T.Nishimura, M.Mitomo: "The effect of additives on sintering behavior and strength retention in silicon nitride with RE-disilicate"J Eur. Ceram. Soc.. 22:(4). 527-534 (2002)
• [Publications] T.Aizawa, T.Akhadejdamrong, C.Iwamoto, Y.Ikuhara, A.Mitsuo: "Self-Lubrication of Chlorine-Implanted TiN Coating"J.Am. Ceram. Soc.. 85. 21-248 (2002)
• [Publications] N.Shibata, M.Morishige, T.Yamamoto, Y.Ikuhara, T.Sakuma: "Stacking-fault formation in [001]small-angle symmetric tilt grain boundaries in cubic zirconia bicrystals"Phil. Mag. Let.. 82. 175-181 (2002)
• [Publications] T.Araki, I.Hirabayashi, J.Shibata, Y.Ikuhara: "High critical current density scheme of YBa_2Cu_3O_<7-x> films by metalorganic deposition using trifluoroacetates"Supercond. Sci. Technol.. 15. 913-916 (2002)
• [Publications] Y.H.Ikuhara, X.L.Ma, Y.Iwamoto, Y.Ikuhara, K.Kikuta, S-I.Hirano: "Interfaces between solution-derived LiMn_2O_4 thin films and MgO and Au/MgO substrates"J. Mater. Res.. 17. 358-366 (2002)
• [Publications] T.Suga: "Lead-free roadmap 2002 -Roadmap 2002 for commercialization of lead-free solder-"Care Innovation '02, Proceedings.. 1(CD). 14.3 (2002)
• [Publications] H.Okada, T.Nara, M.M.R.Howlader, H.Takagi, R.Maeda, T.Itoh, T.Suga: "Sealing using sufrace activated bonding method"Eurosensors XVI, Abstract. 1. 137-138 (2002)
• [Publications] T.Itoh, S.Kawamura, K.Kataoka, T.Suga: "Electroplated Ni microcantilevers for fritting-contact MEMS probe card"Eurosensors XVI, Abstract. 1. 139-140 (2002)
• [Publications] T.Suga, T.Itoh, Z.H.Xu, M.Tomita, A.Yamauchi: "Surface activated bonding for new flip chip and bumpless interconnect systems"IEEE, Electronic Components & Technology Conf. (ECTC), 52nd., Proceedings. 1. 105-111 (2002)
• [Publications] Q.Wang, Z.H.Xu, M.M.R.Howlader, T.Itoh, T.Suga: "Reliability and microstructure of Au-Al and Au-Cu direct bonding fabricated by the surface activated bonding"IEEE, Electronic Components & Technology Conf.(ECTC), 52nd., Proceedings. 1. 915-919 (2002)
• [Publications] T.Suga, A.Takahashi, M.M.R.Howlader, K.Saijo, S.Oosawa: "A lamination technique of LCP/Cu for electronic packaging"IEEE, Int.Conf.on Polymers and Adhesives in Microelectronics and Photonics, 2nd, Proceedings. 1. 177-182 (2002)
• [Publications] Z.H.Xu, M.Tomita, T.Itoh, T.Suga: "Flip-chip bonding using SAB technique at low temperature"IEEE, Int.Symp.on High Density Packaging and Component Failure Analysis in Electronics Manufacturing, 5th, (HDP'2002), Proceedings. 1. 95-98 (2002)
• [Publications] T.Suga, K.Saito: "A new bumping process using lead-free solder paste"IEEE, Int. Symp. on High Density Packaging and Component Failure Analysis in Electronics Manufacturing, 5th, (HDP'2002), Proceedings. 1. 1-3 (2002)
• [Publications] K.Saito, T.Itoh, T.Suga: "A new bumping process using non-residue and lead-free solder paste"Int. Conf. on Electronics Packaging (ICEP), 2002, Proceedings. 1. 99-103 (2002)
• [Publications] K.Suganuma, T.Tsukui, T.Suga, T.Makimoto: "JIEP low temperature lead-free soldering Project"Int. Conf. on Electronics Packaging (ICEP), 2002, Proceedings. 1. 74-78 (2002)
• [Publications] K.Otsuka, C.Ueda, Y.Odate, T.Usami, T.Suga: "Study of beyond GHz signal integrity under TEM wave mode analysis in multi-channel transmission lines"Int. Conf. on Electronics Packaging (ICEP), 2002, Proceedings. 1. 295-300 (2002)
• [Publications] Y.Odate, T.Usami, K.Otsuka, T.Suga: "Transmission performance inteconnections designed by FDTD"Int. Conf. on Electronics Packaging (ICEP), 2002, Proceedings. 1. 307-310 (2002)
• [Publications] T.Suga, T.Itoh, A.Shigetou: "Next generation electronic packaging and bumpless interconnection"Int. Symp. on Microeletronics and Packaging, 1st., (ISMP2002), Proceedings. 1. 247-252 (2002)
• [Publications] K.Kataoka, T.Itoh, K.Okumura, T.Suga: "Low contact force probing on copper electrodes"Int. Test Conf. (ITC), 2002. 1. 424-429 (2002)
• [Publications] K.Kataoka, S.Kawamura, T.Itoh, K.Ishikawa, H.Honma, T.Suga: "Electroplating Ni micro-cantilevers for low contact-force IC probing"Sensors and Actuators. 1. 116-121 (2002)
• [Publications] K.Saito, Y.Akiyama, T.Usami, K.Otsuka, T.Suga: "Replacement of bypass capacitor to transmission line for high frequency power supply system"VLSI Packaging Workshop of JAPAN, 6th, Technical Digest. 1. 137-144 (2002)
• [Publications] T.Suga: "Room temperature joining of inorganic materials and its application in microelectonics"CIMTEC '02-10th Int. Ceramics Congress & 3rd Forum on New Materials, Abstract. 1. 59 (2002)
• [Publications] 梅田靖, 大橋敏二郎, 岸田俊二, 木村文彦, 須賀唯知, 高田祥三, 福田敏男, 山際康之, 古川勇二: "ライフサイクルデザイン指標の体系化-日本学術会議生産システム学専門委員会の議論を中心として-第1報:基本的な考え方"エコデザインジャパンシンポジウム論文集'02. 1. 60-63 (2002)
• [Publications] 梅田靖, 大橋敏二郎, 岸田俊二, 木村文彦, 須賀唯知, 高田祥三, 福田敏男, 山際康之, 古川勇二: "ライフサイクルデザイン指標の体系化-日本学術会議生産システム学専門委員会の議論を中心として-第2報:企業におけるアプローチ"エコデザインジャパンシンポジウム論文集'02. 1. 64-67 (2002)
• [Publications] 冨田誠, Z.H.Xu, 伊藤寿浩, 須賀唯知: "表面活性化による低温フリップチップ接合"マイクロエレクトロニクスシンポジウム、第12回、(MES2002)、論文集. 1. 23-26 (2002)
• [Publications] 伊藤寿浩, 河村晋吾, 片岡憲一, 須賀唯知: "マイクロマシンプローブによる低接触カコンタクト"マイクロエレクトロニクスシンポジウム、第12回、(MES2002)、論文集. 1. 103-106 (2002)
• [Publications] 藤野真久, 宮澤薫一, 須賀唯知: "C60ナノウィスカの加熱ホルダによるTEM観察"応用物理学会学術講演会講演予稿集. 1. 1187 (2002)
• [Publications] 河村晋吾, 片岡憲一, 伊藤寿浩, 須賀唯知: "フリッティングを用いた低接触力MEMSプローブカードのためのマイクロカンチレバーの開発(第2報)マイクロカンチレバーの特性"精密工学会学術講演会講演論文集. 1. 335 (2002)
• [Publications] 片岡憲一, 伊藤寿浩, 須賀唯知: "MEMSプローブカードのためのフリッティングコンタクト(第6報)銅電極のフリッティング特性"精密工学会学術講演会講演論文集. 1. 336 (2002)
• [Publications] 岡田浩尚, 前田龍太郎, 高木秀樹, M.M.R.Howlader, 伊藤寿浩, 須賀唯知: "表面活性化法による封止接合(第2報)-評価用Siマイクロ構造の設計と製作-"精密工学会学術講演会講演論文集. 1. 325 (2002)
• [Publications] 須賀唯知: "常温接合の最新動向"日本金属学会分科会シンポジウム予稿 「接合・溶接技術の最前線」. 1. 18 (2002)