Adhesion Study Based on Dendritic Anchor Effects on Glass/Polymer Interfaces

2016 Fiscal Year Final Research Report

• Project/Area Number: 15K14139
• Research Category: Grant-in-Aid for Challenging Exploratory Research
• Allocation Type: Multi-year Fund
• Research Field: Composite materials/Surface and interface engineering
• Research Institution: Tohoku University
• Principal Investigator: Fukushima Takafumi 東北大学, 工学研究科, 准教授 (10374969)
• Co-Investigator(Renkei-kenkyūsha): Bea Jichel 東北大学, 未来科学技術共同研究センター, 助教 (40509874) ; Onishi Masaki 東北大学, 未来科学技術共同研究センター, 産学官連携研究員 (20618615)
• Project Period (FY): 2015-04-01 – 2017-03-31
• Keywords: 接着

Outline of Final Research Achievements

Adhesion mechanism between a thin SiO2 layer formed plasma-CVD at 200 degreeC and a vapor deposited polyimide was studied. The objective of this research is focusing on adhesion strength enhancement using a dendritic anchor effect of the low-temperature deposited Kapton-type polyimide in order to increase reliability of TSV (through-Silicon Vias) to be used for next-generation 3D stacked integrated circuits. The adhesion enhancement mechanism is found to be based on intermolecular interactions between the polyimide and SAM (self-assembled monolayer)-based adhesion promoters in addition to physical shallow anchor effects.

Free Research Field

高分子化学