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2009 Fiscal Year Final Research Report

Development and application of totally low-temperature semiconductor process using atmospheric-pressure plasma

Research Project

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Project/Area Number 19206018
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Research Field Production engineering/Processing studies
Research InstitutionOsaka University

Principal Investigator

YASUTAKE Kiyoshi  Osaka University, 工学研究科, 教授 (80166503)

Co-Investigator(Kenkyū-buntansha) KAKIUCHI Hiroaki  大阪大学, 大学院・工学研究科, 准教授 (10233660)
OHMI Hiromasa  大阪大学, 大学院・工学研究科, 助教 (00335382)
Project Period (FY) 2007 – 2009
Keywords大気圧プラズマ / 半導体プロセス / エピタキシャル / 薄膜成長 / プラズマ酸化 / 機能材料
Research Abstract

We have developed constituent technologies to realize a totally low-temperature semiconductor process by using atmospheric-pressure plasma ; namely in-situ doped Si epitaxial growth at 570℃ by atmospheric-pressure plasma CVD and SiO_2 film formation by atmospheric-pressure plasma oxidation at 400℃. From the electrical measurements, it has been revealed that the prepared Si and SiO_2 films have high qualities for device application.

  • Research Products

    (11 results)

All 2009 2008 2007 Other

All Journal Article (4 results) (of which Peer Reviewed: 4 results) Presentation (4 results) Book (2 results) Remarks (1 results)

  • [Journal Article] n situ doped Si selective epitaxial growth at low temperatures by atmospheric pressure plasma CVD2009

    • Author(s)
      T. Ohnishi, Y. Kirihata, H. Ohmi, H. Kakiuchi, K. Yasutake
    • Journal Title

      ECS Trans. vol.25

      Pages: 309-315

    • Peer Reviewed
  • [Journal Article] High-quality epitaxial Si growth at low temperatures by atmospheric pressure plasma CVD2008

    • Author(s)
      K. Yasutake, H. Ohmi, Y. Kirihata, H. Kakiuchi
    • Journal Title

      Thin Solid Films vol.517

      Pages: 242-244

    • Peer Reviewed
  • [Journal Article] n situ B-doped Si epitaxial growth at low temperatures by atmospheric-pressure plasma CVD2008

    • Author(s)
      Y. Kirihata, T. Nomura, H. Ohmi, H. Kakiuchi, K. Yasutake
    • Journal Title

      Surf. Interface Anal. vol.40

      Pages: 984-987

    • Peer Reviewed
  • [Journal Article] 大気圧プラズマCVD法によるSiの低温・高速エピタキシャル成長2007

    • Author(s)
      安武潔, 大参宏昌, 垣内弘章
    • Journal Title

      応用物理 vol.75

      Pages: 1031-1036

    • Peer Reviewed
  • [Presentation] 大気圧プラズマCVD法による高品質Si系薄膜の低温形成2009

    • Author(s)
      安武潔, 大参宏昌, 垣内弘章
    • Organizer
      第44回応用物理学会スクール「安価, 簡単, 便利~大気圧プラズマの基礎と応用~」
    • Place of Presentation
      筑波大学(筑波市)(招待講演)
    • Year and Date
      2009-04-02
  • [Presentation] 大気圧プラズマCVD法による高品質Si系薄膜の形成2008

    • Author(s)
      安武潔, 垣内弘章, 大参宏昌
    • Organizer
      日本学術振興会プラズマ材料科学第153委員会第87回研究会
    • Place of Presentation
      ホテル明山荘(蒲郡市)(招待講演)
    • Year and Date
      2008-07-02
  • [Presentation] Atmospheric-pressure plasma processes for fabrication of Si and SiO2 thin films at low-temperatures2007

    • Author(s)
      K. Yasutake, H. Ohmi, H. Kakiuchi
    • Organizer
      第18回日本MRS学術シンポジウム
    • Place of Presentation
      日本大学(千代田区)(招待講演)
    • Year and Date
      2007-12-08
  • [Presentation] High-quality epitaxial Si growth at low temperatures by atmospheric pressure plasma CVD2007

    • Author(s)
      K. Yasutake, H. Ohmi, Y. Kirihata, H. Kakiuchi
    • Organizer
      5th Int. Conf. on Silicon Epitaxy and Heterostructures
    • Place of Presentation
      Marseille, France
    • Year and Date
      2007-05-21
  • [Book] 大気圧プラズマ基礎と応用(日本学術振興会プラズマ材料科学第153委員会編)2009

    • Author(s)
      安武潔, 垣内弘章, 大参宏昌, 他
    • Total Pages
      334-338
    • Publisher
      オーム社
  • [Book] NY, Trends in Thin Solid Films Research (ed. A. R. Jost), High-rate and low-temperature film growth technology using stable glow plasma at atmospheric pressure2007

    • Author(s)
      H. Kakiuchi, H. Ohmi, K. Yasutake, et. al.
    • Total Pages
      1-50
    • Publisher
      Nova Science
  • [Remarks]

    • URL

      http://www-ms.prec.eng.osaka-u.ac.jp/

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Published: 2011-06-18   Modified: 2016-04-21  

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