Investigation of interface destruction mechanism by catalyst effect and its application to transfer type 3D printing technology

2021 Fiscal Year Final Research Report

• Project/Area Number: 19K05237
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Review Section: Basic Section 28050:Nano/micro-systems-related
• Research Institution: National Institute of Advanced Industrial Science and Technology
• Principal Investigator: Kanazawa Shusuke 国立研究開発法人産業技術総合研究所, 情報・人間工学領域, 主任研究員 (60783925)
• Project Period (FY): 2019-04-01 – 2022-03-31
• Keywords: 印刷 / 光触媒 / 界面破壊 / 界面制御 / ３Ｄ / MEMS

Outline of Final Research Achievements

This study aimed to elucidate the mechanism of interface breakdown by photocatalysis and to establish a novel exfoliation and transfer technology based on this mechanism. We attempted to control the adhesion force by using the photocatalysis effect, which oxidizes and decomposes the adjacent solid interface, to realize an advanced peeling mechanism. As a result, we established a new process called Photocatalysis Asisted Lift-On Offset Printing (PA-LOOP method), which clearly improved the resolution and fabrication accuracy of micro mechanical structures formed by the additive process. Based on this, a new device, a wind pressure distribution sensor using a hollow structure, was created. Through the implementation of this project, consistent results were obtained from basic science to application.

Free Research Field

印刷エレクトロニクス

Academic Significance and Societal Importance of the Research Achievements

Internet of Thingsやトリリオンセンサなど、無数のセンサデバイスが社会に投入されることが論じられている中で、高性能なセンサ素子を効率良く作製するためのプロセス技術の革新が求められていた。特にカンチレバーやダイヤフラムと呼ばれる中空構造体は、微小な機械変位を利用した種々のセンサコアが実現されている一方、半導体プロセスを用いた製造工程が長大かつ煩雑であった。本研究はアディティブプロセスのみで中空構造体を形成するプロセスの確立を目指し、提案者らの開発したLift-On Offset Printingに光触媒による界面破壊機構を新規導入すべく本提案を実施、遂行した。