2010 Fiscal Year Final Research Report
吸引キャビテーション流を利用する水晶ウエハの超精密三次元マイクロ砥粒加工法の開発
| Project/Area Number |
20560109
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Okayama University |
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Principal Investigator |
OHASHI Kazuhito Okayama University, 大学院・自然科学研究科, 准教授 (10223918)
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| Co-Investigator(Kenkyū-buntansha) |
TSUKAMOTO Shinya 岡山大学, 大学院・自然科学研究科, 教授 (80163773)
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| Project Period (FY) |
2008 – 2010
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| Keywords | 切削・研削加工 / マイクロ砥粒加工 |
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| Research Abstract |
The abrasive machining using a cavitation in reversing suction flow, in which slurry squirts against a wafer urface perpendicularly from a restrictor nozzle by suction of slurry in a machining chamber, is formulated in this study. Machining effect in the developed method and suitable machining conditions of quarts wafers are investigated. Wafer surface profile is dominated in several nanometer revel by the nozzle diameter and the nozzle clearance. The form accuracy of wafer surface is improved by addition of rotating mechanism in a wafer setting stage.
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Research Products
(12 results)
