2009 Fiscal Year Final Research Report
Influence of base layer thickness in orthodontic adhesive whose bond strength is changed by heating
| Project/Area Number |
20791593
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Single-year Grants |
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| Research Field |
Orthodontic/Pediatric dentistry
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| Research Institution | Nihon University |
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Principal Investigator |
NAMURA Yasuhiro Nihon University, 歯学部, 助教 (80386078)
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| Project Period (FY) |
2008 – 2009
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| Keywords | 科矯正用接着材 / マイクロカプセル |
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| Research Abstract |
We have developed an orthodontic adhesive whose bond strength is markedly decreased by heating and evaluated relationship between thickness and bond strength in the adhesive,Thicknesses of the adhesive (50-200μm) were set and the bond strengths were measured with each thickness.As the results,it was found that the bond strength of l00μm thickness is appropriate and available.In addition,We measured bond strength of existing adhesive using bracket built the adhesive layer and it was confirmed that bonding using a bracket with the layer of 100μm is acceptable.
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