2023 Fiscal Year Final Research Report

Development of Diffusion-Bonding Technique for SiC CMC using the principle of TLP-Bonding

Research Project

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Project/Area Number	20K05124
Research Category	Grant-in-Aid for Scientific Research (C)
Allocation Type	Multi-year Fund
Section	一般
Review Section	Basic Section 26030:Composite materials and interfaces-related
Research Institution	Osaka Research Institute of Industrial Science and Technology
Principal Investigator	Ozaki Tomoatsu 地方独立行政法人大阪産業技術研究所, 和泉センター, 主任研究員 (50736395)
Co-Investigator(Kenkyū-buntansha)	津田大大阪公立大学, 工学(系)研究科(研究院), 客員研究員 (80217322)
Project Period (FY)	2020-04-01 – 2024-03-31
Keywords	炭化ケイ素 / 拡散接合 / 金属中間層 / CMC / 透過型電子顕微鏡
Outline of Final Research Achievements	In this study, we developed a liquid phase diffusion bonding (TLP bonding) technique for bonding ceramic matrix composites (CMCs) to obtain high temperature mechanical parts such as aero engines, and worked on clarifying the bonding reaction process. The bonding interface was investigated by fabricating joints with various insert metals using silicon carbide (SiC) ceramics as a substrate to study the chemical reaction behavior of TLP bonding. In the results using Cu-Ti as the insert metal, we found a method to control the thickness of the bonding layer by changing the fluidity of the bonding interface, and good bonding was obtained even with substrates containing surface defects, which is an issue in CMCs application. We also found a new metal foil combination, Cu-Hf, that can be used for TLP bonding.
Free Research Field	セラミックス
Academic Significance and Societal Importance of the Research Achievements	炭化ケイ素（SiC）系材料に対してのTLP接合の研究を進めた結果、接合処理時の接合界面の流動性を変更することで、接合層の厚みを制御する手法を見出すとともに、これまでの銅-チタン系以外のインサート材でも接合品質の高いTLP接合処理を行うことに成功した。これは本研究の接合技術の品質向上と材料の選択性の拡大に寄与する結果であり、高温機械部品の製造技術として活用が期待される。学術的な意義としては、異なるインサート材で形成された接合界面を解析し、界面における金属箔と基板との化学反応過程を明らかにすることで、TLP接合の発現に関わるメカニズムの理解を深めることができた。