Development of a New Slicing Technlogy of brittle materials Using a Horizontal Crack Generated by Laser Induced Thermal Stress

2022 Fiscal Year Final Research Report

• Project/Area Number: 20K05159
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Review Section: Basic Section 26050:Material processing and microstructure control-related
• Research Institution: Sasebo National College of Technology
• Principal Investigator: Morita Hidetoshi 佐世保工業高等専門学校, 機械工学科, 教授 (40332100)
• Project Period (FY): 2020-04-01 – 2023-03-31
• Keywords: レーザ加工 / 熱応力 / き裂誘導 / 水平き裂

Outline of Final Research Achievements

Currently, glass is used in various fields such as in FPD glass field and in smartphone display field. Also, the grind processing with grindstone is commonly used for the removal processing of brittle materials including glass. However, this way is a direct contact processing by grindstone, so it is difficult to process the glass surface without microcracks or breakage. On the other hand, in previous studies, we have discovered that when CO2 laser is scanned under specific condition on the glass surface, almost mirror surface groove is mostly generated along with the curled glass fragments. In our laboratory, we are studying the mechanism of this phenomenon and applying it to the development of new non-contact and highly efficient removal processing technology.

Free Research Field

レーザ加工

Academic Significance and Societal Importance of the Research Achievements

レーザ誘起熱応力を利用することで，水平き裂を誘導することに成功した．これまでガラス表面に対して切断（割断）するための鉛直き裂を誘導する技術はあったが，水平き裂を誘導できることを示した．また，破壊力学や熱力学の知見を利用して加工成立の条件を明らかにしたことで，これらの学術に対する発展に貢献した．特に，これらの知見を利用してスライス加工に適した加工面を得るためにフラットトッププロファイルで矩形熱源形状を用いることを予見できた．