Improvement of surface flatness of a workpiece in double-sided polishing processes

2021 Fiscal Year Final Research Report

• Project/Area Number: 20K14626
• Research Category: Grant-in-Aid for Early-Career Scientists
• Allocation Type: Multi-year Fund
• Review Section: Basic Section 18020:Manufacturing and production engineering-related
• Research Institution: Osaka University
• Principal Investigator: Satake Urara 大阪大学, 工学研究科, 助教 (70828409)
• Project Period (FY): 2020-04-01 – 2022-03-31
• Keywords: 研磨加工 / シリコンウェーハ

Outline of Final Research Achievements

A double-sided polishing process of silicon wafers as semiconductor substrates has serious problems including deterioration in surface flatness of wafers. However, the existing double-sided polishing technologies cannot meet the strict requirements for better surface flatness because the relation between polishing conditions and surface flatness of a finished workpiece remains poorly understood. In this study, we investigated the effect of the rotation speed of a workpiece on the obtained surface flatness. On the basis of the findings, we developed new polishing holders which can achieve better surface flatness.

Free Research Field

生産加工

Academic Significance and Societal Importance of the Research Achievements

本研究では，両面研磨加工において工作物の回転速度が得られる平坦性に及ぼす影響を明らかにした．従来，実験的な検討の難しさから十分な解明がなされてこなかった両面研磨加工中の工作物の回転挙動，およびその挙動が加工結果に及ぼす影響を明らかにした点で学術的意義が高いと言える．また，本研究で示した保持具の設計指針は，シリコンウェーハのみならず，高い平坦性が要求される他の基板材料の両面研磨加工においても適用可能なものであり，その社会的意義も高いと言える．