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2011 Fiscal Year Annual Research Report

形態機能性マイクロ接合によるナノデバイス/CMOS融合型三次元集積回路の創生

Research Project

Project/Area Number 21246061
Research InstitutionKyushu University

Principal Investigator

浅野 種正  九州大学, システム情報科学研究院, 教授 (50126306)

Co-Investigator(Kenkyū-buntansha) 田中 康一郎  九州産業大学, 情報工学部, 准教授 (40253570)
Keywords三次元集積回路 / インターコネクト / 3D-LSI / マイクロ接合 / 常温接合 / プリンティッドエレクトロニクス / クロコン酸
Research Abstract

・LSIのインターコネクト材料としては,コスト負担を軽減するために金の代わりに銅を使用できる技術を開発することに対する要望が強い.一方,生産性を高めるために,接続は加熱せずに常温で行えることが理想である.我々は,先鋭形状のバンプ(突起)電極と開孔をもつ電極を組み合わせ,言わばプラグ$ソケット式の電極構造とすることで機械的かしめ効果を発現させ,実環境下で銅電極どうしの常温接合を可能にする技術を開発した.この技術により,1チップ当たり3万接点を,1接続当たり0.1オーム以下の電気抵抗で接続できる事を示した.
・化合物半導体のように熱的なプロセスには耐えられるが接合時に発生する応力が結晶欠陥を誘発し易い材料とシリコンCMOSを積層接続して新機能を創出する場合,ハンダを使った溶融接続によるマイクロインターコネクトが有効である.先鋭形状のバンプを利用すると,その形態によりハンダを溜め込む効果が発生することを液体シミュレーションにより解析するとともに,実験により検証した.
・フレキシブルな樹脂フィルム上の配線とLSIとを直接インターコネクトできれば,プリンティッドエレクトロニクスの早期実現に大きく貢献できる.先鋭バンプの形態機能性を利用すると,フレキシブル基材として最も有望視されているポリエチレンナフタレート(PEN)フィルム上にメッキで形成した配線電極に対して,LS工をPENのガラス転移点(155℃)以下で接合できることを実験的に示した.
・三次元回路構成の威力を発揮できる応用例として,スイッチ部分に不揮発のメモリー機能を導入した再構成論理がある.本研究で開発を進めるマイクロインターコネクト技術は低温で接合を実施できるため,有機強誘電体メモリー素子が応用目標の一つに入る.新しい有機強誘電体であるクロコン酸の薄膜化を調査した結果,薄膜でも強誘電性を示すことがわかった.

Current Status of Research Progress
Current Status of Research Progress

2: Research has progressed on the whole more than it was originally planned.

Reason

金の代替としての銅製電極による常温接合技術,ハンダとの溶融接合技術,有機樹脂フィルムとLSIの直接接続,三次元集積回路かを目指した新規機能性材料の調査について,計画どおりの,または計画以上の進展があった.一方,電極形状の物理化学シミュレーションのついては,モデル化までを行うにとどまった.

Strategy for Future Research Activity

計画の変更はない.

  • Research Products

    (27 results)

All 2012 2011 Other

All Journal Article (15 results) (of which Peer Reviewed: 14 results) Presentation (11 results) Remarks (1 results)

  • [Journal Article] Impact on TFT Characteristics of Rapid Crystallization of Si Using Nickel-Metal Induced Lateral Crystallization2012

    • Author(s)
      S.Nagata, G.Nakagawa, T.Asano
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 51 Pages: 02BH04

    • DOI

      10.1143/JJAP.51.02BH04

    • Peer Reviewed
  • [Journal Article] High Frequency Signal Transmission Characteristics of Cone Bump Interconnec-tions2012

    • Author(s)
      A.Ikeda, N.Watanabe, T.Asano
    • Journal Title

      Technical Digest of the IEEE International 3D System Integration Conference 2011

      Pages: 1-4

    • Peer Reviewed
  • [Journal Article] Low-Temperature Bonding of LSI Chips to PEN Film Using Au Cone Bump for Heterogeneous Integration2012

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, T.Asano
    • Journal Title

      Technical Digest of the IEEE International 3D System Integration Conference 2011

      Pages: 1-5

    • Peer Reviewed
  • [Journal Article] Ion Beam Bombardment Effect on Contacts in Solution-Processed Single-Walled Carbon Nanotube Thin Film Transistor2011

    • Author(s)
      X. Yi, G. Nakagawa, H. Ozawa, T. Fujigaya, N. Nakashima, and T. Asano
    • Journal Title

      Jpn. J. Appl. Phys

      Volume: 50 Pages: 098003

    • DOI

      DOI:10.1143/JJAP.50.098003

  • [Journal Article] Characteristics of a Novel Compliant Bump for 3-D Stacking With Hig h-Density Inter-Chip Connections2011

    • Author(s)
      N.Watanabe, T.Asano
    • Journal Title

      IEEE Transactions on Components, Packaging and Manufacturing Technology

      Volume: 1 Pages: 83-91

    • DOI

      10.1109/TCPMT.2010.2101450

    • Peer Reviewed
  • [Journal Article] Microjoining of LSI Chips on Poly (ethylene naphthalate) Using Compliant Bump2011

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, T.Higashimachi, T.Asano
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 50 Pages: 06GM05

    • DOI

      10.1143/JJAP.50.06GM05

    • Peer Reviewed
  • [Journal Article] Single-Walled Carbon Nanotube Thin Film Transistor Fabricated Using Solution Prepared with 9,9-Dioctyfluorenyl-2,7-diyl-Bipyridine Copolymer2011

    • Author(s)
      X.Yi, H.Ozawa, G.Nakagawa, T.Fujigaya, N.Nakashima, T.Asano
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 50 Pages: 070207

    • DOI

      10.1143/JJAP.50.070207

    • Peer Reviewed
  • [Journal Article] Suppressing Current Hysteresis of Solution-processed Thin Film Transistor Made of Single-chirality Single-walled Carbon Nanotube Networks2011

    • Author(s)
      X.Yi, G.Nakagawa, H.Ozawa, T.Fujigaya, N.Nakashima, T.Asano
    • Journal Title

      Proceedings of the 7th International TFT Conference

      Pages: 41

    • Peer Reviewed
  • [Journal Article] Investigation of MILC Growth Kinetics for Rapid Crystallization with Emphasis on Grain Filtering2011

    • Author(s)
      S.Nagata, G.Nakagawa, T.Asano
    • Journal Title

      Proceedings of the 7th International TFT Conference

      Pages: 81-82

    • Peer Reviewed
  • [Journal Article] Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Flexible Electronics2011

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, Tanemasa Asano
    • Journal Title

      Proceedings of the 61st Electronic Components and Technology Conference

      Pages: 1770-1774

    • Peer Reviewed
  • [Journal Article] Selective Heating of Microbumps Using Microwave for Low Strain Heterogeneous Chip Stack Integration2011

    • Author(s)
      L.Qiu, T.Asano
    • Journal Title

      Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials

      Pages: 68-69

    • Peer Reviewed
  • [Journal Article] Room-Temperature Bonding of LSI Chips on PEN Film Using Mechanical Caulking of Au Cone Bump2011

    • Author(s)
      T.Shuto, N.Watanabe, A.Ikeda, T.Asano
    • Journal Title

      Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials

      Pages: 787-788

    • Peer Reviewed
  • [Journal Article] Argon Ion Bombardment to Improve Contacts in Solution-Processed Single-Walled Carbon Nanotube Thin Film Transistor2011

    • Author(s)
      X.Yi, G.Nakagawa, H.Ozawa, T.Fujigaya, N.Nakashima, T.Asano
    • Journal Title

      Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials

      Pages: 1266-1267

    • Peer Reviewed
  • [Journal Article] Impact on TFT Characteristics of Rapid Crystallization of Si Using Nickel-Metal Induced Lateral Crystallization2011

    • Author(s)
      S.Nagata, G.Nakagawa, T.Asano
    • Journal Title

      Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials

      Pages: 1422-1423

    • Peer Reviewed
  • [Journal Article] Investigation of Ni Metal Induced Lateral Crystallization with a-Si Film Thickness at Very Thin Extent2011

    • Author(s)
      G.Nakagawa, T.Nakamae, T.Asano
    • Journal Title

      Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials

      Pages: 1426-1427

    • Peer Reviewed
  • [Presentation] High Frequency Signal Transmission Characteristics of Cone Bump Interconnec-tions2012

    • Author(s)
      Akihiro Ikeda
    • Organizer
      IEEE International 3D System Integration Confere nee 2011 (3DIC2011)
    • Place of Presentation
      Osaka
    • Year and Date
      2012-01-30
  • [Presentation] Low-Temperature Bonding of LSI Chips to PEN Film Using Au Cone Bump for Heterogeneous Integration2012

    • Author(s)
      Takanori Shuto
    • Organizer
      IEEE International 3D System Integration Conference 2011 (3DIC2011)
    • Place of Presentation
      Osaka
    • Year and Date
      2012-01-30
  • [Presentation] 異種材料・機能のマイクロ接合技術2011

    • Author(s)
      浅野種正
    • Organizer
      デザインガイア2011
    • Place of Presentation
      宮崎(招待講演)
    • Year and Date
      2011-11-29
  • [Presentation] Impact on TFT Characteristics of Rapid Crystallization of Si Using Nickel-Metal Induced Lateral Crystallization2011

    • Author(s)
      Sho Nagata
    • Organizer
      2011 International Conference on Solid State Devices and Materials (SSDM2011)
    • Place of Presentation
      Nagoya
    • Year and Date
      2011-09-30
  • [Presentation] Investigation of Ni Metal Induced Lateral Crystallization with a-Si Film Thickness at Very Thin Extent2011

    • Author(s)
      Gou Nakagawa
    • Organizer
      2011 International Conference on Solid State Devices and Materials (SSDM2011)
    • Place of Presentation
      Nagoya
    • Year and Date
      2011-09-30
  • [Presentation] Argon Ion Bombardment to Improve Contacts in Solution-Processed Single-Walled Carbon Nanotube Thin Film Transistor2011

    • Author(s)
      Xun Yi
    • Organizer
      2011 International Conference on Solid State Devices and Materials (SSDM2011)
    • Place of Presentation
      Nagoya
    • Year and Date
      2011-09-29
  • [Presentation] High Density Interconnect Technology for Heterogeneous 3D-LSI2011

    • Author(s)
      Tanemasa Asano
    • Organizer
      ITRI-KU Joint Symposium
    • Place of Presentation
      Hsinchu(Invited)
    • Year and Date
      2011-09-29
  • [Presentation] Selective Heating of Microbumps Using Microwave for Low Strain Heterogeneous Chip Stack Integration2011

    • Author(s)
      Lijing Qiu
    • Organizer
      2011 International Conference on Solid State Devices and Materials (SSDM2011)
    • Place of Presentation
      Nagoya
    • Year and Date
      2011-09-28
  • [Presentation] Room-Temperature Bonding of LSI Chips on PEN Film Using Mechanical Caulking of Au Cone Bump2011

    • Author(s)
      Takanori Shuto
    • Organizer
      2011 International Conference on Solid State Devices and Materials (SSDM2011)
    • Place of Presentation
      Nagoya
    • Year and Date
      2011-09-28
  • [Presentation] Self-heating issue of poly-Si TFT on glass substrate2011

    • Author(s)
      Tanemasa Asano
    • Organizer
      Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors III" (ULSI-TFT III)
    • Place of Presentation
      Hong-Kong(Invited)
    • Year and Date
      2011-06-28
  • [Presentation] Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Fiexible Electronics2011

    • Author(s)
      Takanori Shuto
    • Organizer
      61st Electronic Components and Technology Conference (ECTC2011)
    • Place of Presentation
      Orland
    • Year and Date
      2011-06-01
  • [Remarks]

    • URL

      http://hyoka.ofc.kyushu-u.ac.jp/search/details/K002917/index.html

URL: 

Published: 2013-06-26  

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