2012 Fiscal Year Final Research Report
Creation of Nano-device/CMOS Merged Three Dimensional Integrated Circuits Using Shape-Functionalized Micro-interconnect
| Project/Area Number |
21246061
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| Research Category |
Grant-in-Aid for Scientific Research (A)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Electron device/Electronic equipment
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| Research Institution | Kyushu University |
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Principal Investigator |
ASANO Tanemasa 九州大学, 大学院・システム情報科学研究院, 教授 (50126306)
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| Co-Investigator(Kenkyū-buntansha) |
TANAKA Koichiro 九州産業大学, 情報科学部知能情報科, 教授 (40253570)
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| Co-Investigator(Renkei-kenkyūsha) |
HIGASHMACHI Takao 崇城大学, 工学部機械工学科 (50461611)
IKEDA Akihiro 九州大学, 大学院・システム情報科学研究院, 助教 (60315124)
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| Project Period (FY) |
2009 – 2012
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| Keywords | 電子デバイス・集積回路 / インターコネクト・パッケージのシステム化応用 / センシングデバイス |
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| Research Abstract |
Bonding mechanism of cone-shaped microbump electrode, which was invented by the leader of this project research, has been investigated. Application of the mechanism to development of three dimensional integration of semiconductor circuits has also been investigated. This project achieved room temperature bonding of high density micro interconnect, which was not able to carry out using existing technology. The developed technology has been applied to integration of heterogeneous integration on silicon. As anexample, a high-resolution near infrared image sensor has been fabricated using the developed technology.
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