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Products Report

X線透視画像を用いた電子パッケージ内部ひずみの非破壊計測技術の開発

Research Project

Project/Area Number 21560109
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionFukuoka Industrial Technology Center

Principal Investigator

KOGANEMARU Masaaki  福岡県工業技術センター, 機械電子研究所, 専門研究員 (20416506)

Co-Investigator(Kenkyū-buntansha) UCHINO Masakazu  福岡県工業技術センター, 機械電子研究所, 専門研究員 (30416507)
ITOHIRA Keiichi  福岡県工業技術センター, 機械電子研究所, 主任技師 (90463497)
Co-Investigator(Renkei-kenkyūsha) IKEDA Toru  京都大学, 工学研究科, 准教授 (40243894)
MIYAZAKI Noriyuki  京都大学, 工学研究科, 教授 (10166150)
ASANO Tanemasa  九州大学, システム情報科学研究科, 教授 (50126306)
Project Period (FY) 2009 – 2011
  • Research Products

    (1 results)

All 2014

All Journal Article (1 results)

  • [Journal Article] Examination of Residual Stress Measurement in Electronic Packages Using Phase-Shifted Sampling Moiré Method and X-Ray Images2014

    • Author(s)
      Masaaki Koganemaru, Masakazu Uchino, Akihiro Ikeda, and Tanemasa Asano
    • Journal Title

      Electronics System-Integration Technology Conference (ESTC), 2014

      Pages: 1-5

    • DOI

      10.1109/ESTC.2014.6962827

URL: 

Published: 2016-04-26   Modified: 2016-09-09  

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