| Project/Area Number |
21560109
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Fukuoka Industrial Technology Center |
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Principal Investigator |
KOGANEMARU Masaaki 福岡県工業技術センター, 機械電子研究所, 専門研究員 (20416506)
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| Co-Investigator(Kenkyū-buntansha) |
UCHINO Masakazu 福岡県工業技術センター, 機械電子研究所, 専門研究員 (30416507)
ITOHIRA Keiichi 福岡県工業技術センター, 機械電子研究所, 主任技師 (90463497)
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| Co-Investigator(Renkei-kenkyūsha) |
IKEDA Toru 京都大学, 工学研究科, 准教授 (40243894)
MIYAZAKI Noriyuki 京都大学, 工学研究科, 教授 (10166150)
ASANO Tanemasa 九州大学, システム情報科学研究科, 教授 (50126306)
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| Project Period (FY) |
2009 – 2011
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| Project Status |
Completed (Fiscal Year 2011)
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| Budget Amount *help |
¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000)
Fiscal Year 2011: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2010: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2009: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
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| Keywords | 電子デバイス・機器 / エレクトロニクス実装 / 実験力学 / 機械材料・材料力学 / デバイス設計・製造プロセス |
|---|
| Research Abstract |
A new method of nondestructive strain measurement for electronic packages ware developed. In this method, the strain in electronic packages was obtained by applying a sampling moire method to x-ray image. It was demonstrated that whole-field distribution of the strain in electronic packages can be obtained by this method.
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