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A new method of nondestructive strain measurement for electronic packages using x-ray images

Research Project

Project/Area Number 21560109
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionFukuoka Industrial Technology Center

Principal Investigator

KOGANEMARU Masaaki  福岡県工業技術センター, 機械電子研究所, 専門研究員 (20416506)

Co-Investigator(Kenkyū-buntansha) UCHINO Masakazu  福岡県工業技術センター, 機械電子研究所, 専門研究員 (30416507)
ITOHIRA Keiichi  福岡県工業技術センター, 機械電子研究所, 主任技師 (90463497)
Co-Investigator(Renkei-kenkyūsha) IKEDA Toru  京都大学, 工学研究科, 准教授 (40243894)
MIYAZAKI Noriyuki  京都大学, 工学研究科, 教授 (10166150)
ASANO Tanemasa  九州大学, システム情報科学研究科, 教授 (50126306)
Project Period (FY) 2009 – 2011
Project Status Completed (Fiscal Year 2011)
Budget Amount *help
¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000)
Fiscal Year 2011: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2010: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2009: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
Keywords電子デバイス・機器 / エレクトロニクス実装 / 実験力学 / 機械材料・材料力学 / デバイス設計・製造プロセス
Research Abstract

A new method of nondestructive strain measurement for electronic packages ware developed. In this method, the strain in electronic packages was obtained by applying a sampling moire method to x-ray image. It was demonstrated that whole-field distribution of the strain in electronic packages can be obtained by this method.

Report

(5 results)
  • 2011 Annual Research Report   Final Research Report ( PDF )
  • 2010 Annual Research Report
  • 2009 Annual Research Report
  • Products Report
  • Research Products

    (1 results)

All 2014

All Journal Article (1 results)

  • [Journal Article] Examination of Residual Stress Measurement in Electronic Packages Using Phase-Shifted Sampling Moiré Method and X-Ray Images2014

    • Author(s)
      Masaaki Koganemaru, Masakazu Uchino, Akihiro Ikeda, and Tanemasa Asano
    • Journal Title

      Electronics System-Integration Technology Conference (ESTC), 2014

      Pages: 1-5

    • DOI

      10.1109/estc.2014.6962827

    • Related Report
      Products Report

URL: 

Published: 2009-04-01   Modified: 2016-09-09  

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