2012 Fiscal Year Final Research Report
Development and Application of Heat-resistance Molecular Level Composites with semi-IPN Structure
| Project/Area Number |
22550174
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Organic industrial materials
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| Research Institution | Sasebo National College of Technology |
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Principal Investigator |
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| Co-Investigator(Kenkyū-buntansha) |
TAKEICHI Tsutomu 豊橋技術科学大学, 大学院工学研究科, 教授 (90126938)
JOHONO Yuuki 佐世保工業高等専門学校, 物質工学科, 准教授 (80353233)
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| Project Period (FY) |
2010 – 2012
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| Keywords | 接着剤 / 耐熱有機材料 |
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| Research Abstract |
Recently, polyimides have been widely used for insulators and adhesive films because of the heat resistance, electric properties and durability. In this research, new class of molecular level composites composed of an thermoplastic aromatic polyimide with phenolic hydeoxy group and benzoxazines were developed, and relationship between the composition and various properties were studied. The hydroxyl in the polyimide chain group was introduced as catalysis for ring opening polymerization of benzoxazines. The molecular level composites exhibited flexible and high heat resistance. In addition, the lap shear bond strength and peel strength of composite films were evaluated and the composites have good adhesive properties for industrial application.
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