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2012 Fiscal Year Final Research Report

Improvement of Indentation Creep Method for Electronic Packages by Monitoring Stress Relaxation Behavior

Research Project

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Project/Area Number 22560070
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionAkita University

Principal Investigator

OHGUCHI Ken-ichi  秋田大学, 工学資源学研究科, 准教授 (30292361)

Project Period (FY) 2010 – 2012
Keywords応力緩和 / インデンテーション / クリープ / 電子実装基板
Research Abstract

The indentation creep test is expected to be put into practical use for evaluating the strength reliability of electronic packages. However, there is a problem that the creep law derived by the test does not correspond to that derived by tensile creep tests. This study showed that this problem was caused by the definition of the reference area for calculating the stress in the indentation test. Based on this fact, a new reference area for indentation tests and a new indentation test method which evaluates creep characteristics by monitoring stress relaxation behavior were proposed.

  • Research Products

    (2 results)

All 2013 2012

All Presentation (2 results)

  • [Presentation] A New Reference Area for Indentation Creep Tests to Obtain Real Steady Creep Strain of Solder Alloy2013

    • Author(s)
      Atsuko Takita, Katsuhiko Sasaki, and Ken-ichi Ohguchi
    • Organizer
      International Conference on Electronics Packaging 2013
    • Place of Presentation
      Osaka International Convention Center
    • Year and Date
      2013-04-12
  • [Presentation] 圧子押込み・深さ保持によるはんだのクリープ特性評価法の提案2012

    • Author(s)
      瀧田敦子、大口健一、佐々木克彦
    • Organizer
      日本機械学会2012 年度年次大会
    • Place of Presentation
      金沢大学
    • Year and Date
      2012-09-10

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Published: 2014-08-29  

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