2012 Fiscal Year Final Research Report
Improvement of Indentation Creep Method for Electronic Packages by Monitoring Stress Relaxation Behavior
| Project/Area Number |
22560070
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Akita University |
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Principal Investigator |
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| Project Period (FY) |
2010 – 2012
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| Keywords | 応力緩和 / インデンテーション / クリープ / 電子実装基板 |
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| Research Abstract |
The indentation creep test is expected to be put into practical use for evaluating the strength reliability of electronic packages. However, there is a problem that the creep law derived by the test does not correspond to that derived by tensile creep tests. This study showed that this problem was caused by the definition of the reference area for calculating the stress in the indentation test. Based on this fact, a new reference area for indentation tests and a new indentation test method which evaluates creep characteristics by monitoring stress relaxation behavior were proposed.
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