2012 Fiscal Year Final Research Report
High-Temperature Creep Testing Method using Small Sample Specimens
Project/Area Number |
22560072
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Research Category |
Grant-in-Aid for Scientific Research (C)
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Allocation Type | Single-year Grants |
Section | 一般 |
Research Field |
Materials/Mechanics of materials
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Research Institution | Chiba University |
Principal Investigator |
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Co-Investigator(Renkei-kenkyūsha) |
NONAKA Isamu 東北大学, 大学院・工学研究科, 教授 (40522066)
TABUCHI Masaaki (独)物質・材料研究機構, 材料信頼センター, グループリーダー (60354239)
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Project Period (FY) |
2010 – 2012
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Keywords | 微小クリープ / 余寿命診断 / 試験法 / スモール・パンチ |
Research Abstract |
Small Punch Creep (SPC) test is one of the semi-destructive tests employing miniature specimens. Some factors of the SPC test affecting test results were experimentally studied.It was found that rupture lives conducted in air were quite different from those in vacuumwhen the rupture life was shorter than 1000 hours. This result depended on the influenceof the oxide film and the coefficient of friction. However, there was a good relation betweenthe stress in the conventional uni-axial creep test and the load in the SPC test when therupture rife was the same. This relationship helps to evaluate remaining creep life oflong-term serviced components under elevated temperatures.
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