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2012 Fiscal Year Final Research Report

Development of self-cooling device using high conductivity and high thermopower thermoelectric materials

Research Project

  • PDF
Project/Area Number 22560691
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Structural/Functional materials
Research InstitutionYokohama National University

Principal Investigator

NAKATSUGAWA Hiroshi  横浜国立大学, 工学研究院, 准教授 (40303086)

Co-Investigator(Kenkyū-buntansha) OKAMOTO Yoichi  防衛大学校, 電気情報学群, 准教授 (10546063)
Co-Investigator(Renkei-kenkyūsha) YAMAGUCHI Satarou  中部大学, 超電導・持続可能エネルギー研究センター, 教授 (10249964)
KAWAHARA Toshio  中部大学, 超電導・持続可能エネルギー研究センター, 教授 (80437350)
Project Period (FY) 2010 – 2012
Keywords熱 / エネルギー材料
Research Abstract

The self-cooling device has been developed by combining the commercial n-channel power MOSFET and single-crystalline Sb doped n-type and/or B doped p-type silicon wafers in order to improve heat removal or cooling. We find for the first time that the average temperature of the upper side on the power MOSFET with the n-type silicon wafer is cooled down about 2℃, in which the electric current of 40A flows from lower to upper direction of the self-cooling device. This certainly warrants future work on the improvement of the measurement condition.

  • Research Products

    (8 results)

All 2012 2011 2010 Other

All Journal Article (2 results) (of which Peer Reviewed: 2 results) Presentation (4 results) Remarks (2 results)

  • [Journal Article] Self-cooling on power MOSFET using n-type Si wafer2012

    • Author(s)
      H. Nakatsugawa, T. Sato, Y. Okamoto, T.Kawahara, and S.Yamaguchi
    • Journal Title

      9th European Conference on Thermoelectrics AIP Conference Proceedings

      Volume: Vol.1449 Pages: 548-551

    • Peer Reviewed
  • [Journal Article] Thermoelectric Properties of Single-Crystalline SiC and Dense Sintered SiC for Self-Cooling Devices2011

    • Author(s)
      S. Fukuda, T. Kato, Y. Okamoto, H.Nakatsugawa, H. Kitagawa, and S. Yamaguchi
    • Journal Title

      Jpn. J. Appl. Phys

      Volume: Vol.50, No.3 Pages: 031301-1-031301-5

    • Peer Reviewed
  • [Presentation] Self-cooling on power MOSFET using copper plating single-crystalline silicon wafers2012

    • Author(s)
      H. Nakatsugawa, Y. Okamoto, S. Yamaguchi, T. Kawahara
    • Organizer
      International Union of Materials Research Societies-International Conference on Electronic Materials 2012 (Invited)
    • Place of Presentation
      Yokohama Japan
    • Year and Date
      20120923-28
  • [Presentation] Observation of self-cooling on power MOSFET with silicon wafers using infrared thermography2012

    • Author(s)
      H. Nakatsugawa, Y. Okamoto, S. Yamaguchi, T. Kawahara
    • Organizer
      The 31^<st> International and 10^<th> European Conference on Thermoelectrics
    • Place of Presentation
      Aalborg Denmark
    • Year and Date
      20120709-12
  • [Presentation] Self-cooling on power MOSFET using n-type Si wafer2011

    • Author(s)
      H. Nakatsugawa, T. Sato, Y. Okamoto, T.Kawahara, S. Yamaguchi
    • Organizer
      9^<th> European Conference on Thermoelecrics
    • Place of Presentation
      Thessaloniki Greece
    • Year and Date
      20110928-30
  • [Presentation] Application of High-Thermoelectric-Power Materials to Self-Cooling Device2010

    • Author(s)
      H. Nakatsugawa, Y. Okamoto, S. Yamaguchi, T. Kawahara
    • Organizer
      The 3^<rd> International Congress on Ceramics
    • Place of Presentation
      Osaka Japan
    • Year and Date
      20101116-18
  • [Remarks]

    • URL

      http://nakatsugawa-lab.jp/

  • [Remarks]

    • URL

      http://er-web.jmk.ynu.ac.jp/html/NAKATSUGAWA_Hiroshi/ja.html?k=%E4%B8%AD%E6%B4%A5%E5%B7%9D

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Published: 2014-08-29  

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