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2012 Fiscal Year Final Research Report

Effect of miniaturization of solder joint for electronics packagingon interfacial reaction between solder and substrate and impact reliability of the joint

Research Project

  • PDF
Project/Area Number 22560721
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Material processing/treatments
Research InstitutionOsaka University

Principal Investigator

NISHIKAWA Hiroshi  大阪大学, 接合科学研究所, 准教授 (90346180)

Co-Investigator(Renkei-kenkyūsha) SERIZAWA Hisashi  大阪大学, 接合科学研究所, 准教授 (20294134)
Project Period (FY) 2010 – 2012
Keywordsエレクトニクス実装 / 微細接合 / 微細化
Research Abstract

As solder bumps become increasingly miniaturized to meet the severdemands of future electronic packaging, it is important to consider whether the solderjoint size and geometry could become reliability issues and thereby affect implementationof the Pb-free solders. In this study, the effect of the solder bump size on the interfacialreaction between the solder and a substrate and the impact reliability using a miniatureimpact tester was investigated. Experimental results suggest that the solder bump sizecan influence the interfacial reaction and the impact reliability of the solder bump.

  • Research Products

    (5 results)

All 2013 2012 2011

All Presentation (5 results)

  • [Presentation] レーザはんだ付したはんだバンプ衝撃強度に及ぼす微細化の影響2013

    • Author(s)
      宇治野真、西川 宏
    • Organizer
      スマートプロセス学会春季総合学術講演会
    • Place of Presentation
      大阪大学
    • Year and Date
      2013-05-22
  • [Presentation] Effect of isothermal Aging on Sn-Ag-Cusolder joints on electroless Ni-P/Auplating by laser reflow soldering2012

    • Author(s)
      H. Nishikawa, N. Iwata, T. Takemoto
    • Organizer
      5th International Brazing and SolderingConference (IBSC 2012)
    • Place of Presentation
      Las Vegas, USA
    • Year and Date
      20120422-25
  • [Presentation] Intermetallic Compound Formation andGrowth at the Lead-Free Solder/CuInterface during Laser Reflow Solderingand during Isothermal Aging2012

    • Author(s)
      H. Nishikawa, N. Iwata and T. Takemoto
    • Organizer
      141st AnnualMeeting &Exhibition (TMS2012)
    • Place of Presentation
      Florida, USA
    • Year and Date
      20120311-15
  • [Presentation] Impact reliability ofmicro-joints soldered with Sn-Ag-Cusolder using laser process2011

    • Author(s)
      H. Nishikawa
    • Organizer
      Sino-JapaneseWorkshop on Welding Thermo-Physics(招待講演)
    • Place of Presentation
      済南(中国)
    • Year and Date
      2011-11-09
  • [Presentation] 低融点はんだ/Cu 継手の耐落下衝撃性評価2011

    • Author(s)
      山本晃将、西川 宏
    • Organizer
      日本金属学会2011年秋期大会
    • Place of Presentation
      沖縄コンベンションセンター
    • Year and Date
      2011-11-07

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Published: 2014-08-29  

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