2012 Fiscal Year Final Research Report
Novel ultra-low-modulus flame retardant polyimides for cover layer materials
| Project/Area Number |
23750260
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Polymer/Textile materials
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| Research Institution | Toho University |
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Principal Investigator |
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| Project Period (FY) |
2011 – 2012
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| Keywords | ポリイミド / 絶縁保護膜 / 低弾性率 / 難燃性 / 接着力 / モルフォロジー / 感光性 / ポジ |
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| Research Abstract |
Two types of ultra-low-modulus polyimides (PIs) with/without photosensitivity were developed as novel cover layer materials for applications to flexible printed circuit boards (FPC) in this work. Our photosensitive PI cast film exhibited an extremely low tensile modulus of 0.28 GPa, which is low enough for avoiding an undesirable FPC curling phenomenon, in addition to the highest level of non-flammability (UL-94, VTM-0), compatibility to the solder reflow process, good photosensitivity for fine pattern formation. We also developed novel screen-printable ultra-low-modulus copolyimides systems without photosensitivity. The copolyimides displayed an extremely low modulus of 0.015 GPa and an excellent adhesion strength with copper foil (2.3 kgf/cm)
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