Research and development of DC power supply integrated in LSI package with embedded planar power inductor

2014 Fiscal Year Final Research Report

• Project/Area Number: 24560328
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Power engineering/Power conversion/Electric machinery
• Research Institution: Shinshu University
• Principal Investigator: SATO Toshiro 信州大学, 学術研究院工学系, 教授 (50283239)
• Co-Investigator(Renkei-kenkyūsha): SAKURAI Takayasu 東京大学, 生産技術研究所, 教授 (90282590)
• Project Period (FY): 2012-04-01 – 2015-03-31
• Keywords: パワーエレクトロニクス / LSIパッケージ / パッケージレベルDCパワーグリッド / DC-DCコンバータ / パワーインダクタ

Outline of Final Research Achievements

In this study, in order to realize the DC power supply to CMOS logic LSI, power inductors embedded in an organic interposer using two types of magnetic cores (Zn-Fe ferrite thick film and carbonyl-iron/epoxy composite thick film) have been developed, and the CMOS switch buck DC-DC converter has been developed and evaluated. The developed 180 nm-CMOS switch buck DC-DC converter with embedded Zn-Fe ferrite core inductor has typical specifications as follows; switching frequency; 50 MHz, main circuit conversion efficiency; 74% at 2 V input/0.855V-1A output condition. The interposer-embedded power inductor and interposer-integrated CMOS switch DC-DC converter technologies will enable to realize the package-level DC power grid contributing to save electric energy in various electronic systems.

Free Research Field

電気電子工学