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2014 Fiscal Year Final Research Report

Preparation of low-temperature SiNx films by using new deposition method applicable to 3-dimensional LSI

Research Project

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Project/Area Number 24560361
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Electronic materials/Electric materials
Research InstitutionKitami Institute of Technology

Principal Investigator

TAKEYAMA MAYUMI  北見工業大学, 工学部, 准教授 (80236512)

Co-Investigator(Kenkyū-buntansha) NOYA Atsushi   (60133807)
Co-Investigator(Renkei-kenkyūsha) MACHIDA Hideaki   (30535670)
Research Collaborator SATO Masaru  
NAKAMURA Tomoji  
NAKATA Yoshihiro  
KOBAYASHI Yasushi  
Project Period (FY) 2012-04-01 – 2015-03-31
Keywords薄膜プロセス / シリコン貫通ビア / 3次元集積回路 / 低温プロセス / 絶縁バリヤ / SiNx膜
Outline of Final Research Achievements

In the through silicon via process for the 3-dimensional LSI, SiNx films of high density are strongly required to prepare at low temperatures. As a solution of this issue, we propose the use of SiNx films deposited by reactive sputtering. We can obtain the sputtered SiNx films of high density by the deposition without substrate heating. This film tolerated annealing at 700℃ for 1 h without Cu diffusion. It implies that the low-temperature deposited high density SiNx film is a useful insulating barrier. In addition, the reason why the PECVD-SiNx films show low density is clarified by comparing the characteristics of SiNx films by sputtering and PECVD methods.

Free Research Field

工学

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Published: 2016-06-03  

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