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2015 Fiscal Year Final Research Report

Study on Deposition Mechanism of Contamination and Its Influences on Thermal Resistance at Liquid-Solid Interface

Research Project

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Project/Area Number 26630065
Research Category

Grant-in-Aid for Challenging Exploratory Research

Allocation TypeMulti-year Fund
Research Field Thermal engineering
Research InstitutionOsaka University

Principal Investigator

Shibahara Masahiko  大阪大学, 工学(系)研究科(研究院), 教授 (40294045)

Project Period (FY) 2014-04-01 – 2016-03-31
Keywordsナノマイクロ熱工学 / 固液界面熱抵抗
Outline of Final Research Achievements

In the present study, wall contamination on a heat transfer surface is considered a process of fine particle accumulation on the heat transfer surface. The final scope of the present study is to build a physical model where contamination accumulated on the solid-liquid interface affects the interfacial thermal resistance. An experiment is performed to evaluate the interfacial thermal resistance with and without nanoparticle accumulation. In addition, molecular dynamics simulations are performed to numerically investigate the interfacial thermal resistance. Experimental results are consistent with results of the molecular dynamics simulations. Based on those results, deeper understanding of the interfacial thermal resistance with the contamination particles on the interface is obtained.

Free Research Field

機械工学・熱工学

URL: 

Published: 2017-05-10  

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