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低温大気中接合によるウエハスケール3次元集積化に関する研究

Research Project

Project/Area Number 08F08386
Research Category

Grant-in-Aid for JSPS Fellows

Allocation TypeSingle-year Grants
Section外国
Research Field Electron device/Electronic equipment
Research InstitutionThe University of Tokyo

Principal Investigator

須賀 唯知  東京大学, 大学院・工学系研究科, 教授

Co-Investigator(Kenkyū-buntansha) 王 英輝  東京大学, 大学院・工学系研究科, 外国人特別研究員
Project Period (FY) 2008 – 2010
Project Status Completed (Fiscal Year 2010)
Budget Amount *help
¥2,000,000 (Direct Cost: ¥2,000,000)
Fiscal Year 2010: ¥500,000 (Direct Cost: ¥500,000)
Fiscal Year 2009: ¥800,000 (Direct Cost: ¥800,000)
Fiscal Year 2008: ¥700,000 (Direct Cost: ¥700,000)
Keywordsウエハ接合 / 金属薄膜 / 表面活性化 / 無鉛はんだ / 表面酸化
Research Abstract

最終年度は、ウエハの金属薄膜を介した接合を、大気中低温での接合に適用することを検討した。Au、Sn、Cuの薄膜のうち、Auを用いて接合面のパターン化を行い、平面状の接合面では応力集中がコーナー、エッジ部にあること、これを解消するために、接合面を微細なパターンに分割することが有効であることを実験的に示した。具体的には、Siウエハにシード層としてTi膜、その上にAuのEB蒸着膜を100nm形成したもの、および3μm厚のAuの電解メッキ膜をエッチングにより、バンプ状パターンにしたものを用いた。その結果、バンプピッチが広いほど、バンプサイズを10μmから5μmへと小さくするほど、エッジ部の不均一性が解消し、応力分布がなだらかとなることがわかった。これらの結果を検証するため、応力集中の2次元計算を有限要素法を用いて計算し、パターンの分割周期やパターン幅がどのように接合面の応力の均一性に寄与するかをさらに定量的に示した。その結果、接合における不均一性は接合加圧時の応力分布に比例して増加していることも判明した。また、シリコンの大気中低温接合については、150℃程度の低温加熱であれば、Au、Snについてはアルゴンプラズマでの活性化後、接合可能であることが明らかとなった。これらの成果は、Geウエハの直接接合に適用された。ドープの程度の異なるしたGeウエハの接合では、界面には5nm程度のアモルファスは形成されるものの、通常のエピタキシャル成長で形成される界面と比べると格段にシャープなプロファイルの界面が形成された。これは、界面での光電変換素子機能を使う場合においては重要な要件であり、この手法の有効性が示された。

Report

(3 results)
  • 2010 Annual Research Report
  • 2009 Annual Research Report
  • 2008 Annual Research Report
  • Research Products

    (20 results)

All 2010 2009 2008

All Journal Article (3 results) (of which Peer Reviewed: 3 results) Presentation (17 results)

  • [Journal Article] High-Precision Alignment for Low Temperature Wafer Bonding2009

    • Author(s)
      Chenxi Wang, Shingo Taniyama, Ying-Hui Wang, Tadatomo Suga
    • Journal Title

      Journal of Electrochemical Society 156

    • Related Report
      2008 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Low-Temperature Bumpless Bonding for SAW Components2008

    • Author(s)
      Ying-Hui Wang, Takahiro Sato, Tsuyoshi Sugiura, Tadatomo Suga
    • Journal Title

      Japanese Journal of Applied Physics 47

      Pages: 2521-2525

    • Related Report
      2008 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Effect of Surface Contamination on Solid-State Bondability of Sn-Ag-Cu Bumps in Ambient Air2008

    • Author(s)
      Ying-Hui Wang, Tadatomo Suga
    • Journal Title

      Jou Materials Transactions 49

      Pages: 1508-1512

    • Related Report
      2008 Annual Research Report
    • Peer Reviewed
  • [Presentation] Influence of Bonding Atmosphere on Low-Temperature Wafer Bonding2010

    • Author(s)
      Ying-Hui Wang
    • Organizer
      the 60th Electronic Components and Technology Conference (ECTC 2010)
    • Place of Presentation
      Las Vegas, USA
    • Related Report
      2010 Annual Research Report
  • [Presentation] Low-Temperature Bonding for Microdevices2010

    • Author(s)
      Ying-Hui Wang
    • Organizer
      Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS
    • Place of Presentation
      Seville, Spain
    • Related Report
      2010 Annual Research Report
  • [Presentation] Surface Activation for Micro-Bumps and Its Improvement on Bonding at Low Temperature2010

    • Author(s)
      Ying-Hui Wang
    • Organizer
      International Conference on Electronics Packaging (ICEP 2010)
    • Place of Presentation
      Sapporo Convention Center, Hokkaido, Japan
    • Related Report
      2010 Annual Research Report
  • [Presentation] Low Temperature Bonding of Si Wafers in Nitrogen Atmosphere2010

    • Author(s)
      Keigo Oshikawa
    • Organizer
      International Conference on Electronics Packaging (ICEP 2010)
    • Place of Presentation
      Sapporo Convention Center, Hokkaido, Japan
    • Related Report
      2010 Annual Research Report
  • [Presentation] Metal Surface Cleanliness and Its Improvement on Bonding2010

    • Author(s)
      Ying-hui Wang
    • Organizer
      International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
    • Place of Presentation
      Xian, China
    • Related Report
      2010 Annual Research Report
  • [Presentation] [Keynote] Low temperature wafer bonding for 3D system integration2010

    • Author(s)
      Tadatomo Suga
    • Organizer
      International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
    • Place of Presentation
      Xian, China
    • Related Report
      2010 Annual Research Report
  • [Presentation] Low Temperature/Room Temperature Bonding of Si Wafer in Ambient Air and N_22010

    • Author(s)
      王英輝
    • Organizer
      2nd International IEEE Workshqp on Low Temperature Bonding for 3D Integration
    • Place of Presentation
      東京
    • Related Report
      2009 Annual Research Report
  • [Presentation] Low Temperature Bonding of Ge for Infrared Detectors2010

    • Author(s)
      倉山竜二
    • Organizer
      2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration
    • Place of Presentation
      東京
    • Related Report
      2009 Annual Research Report
  • [Presentation] Low-temperature Wafer Bonding Using Gold Layers2009

    • Author(s)
      王英輝
    • Organizer
      International Conference on Electronic Packaging Technology & High Density Packaging(ICEPT-HDP)
    • Place of Presentation
      Beijing,China
    • Related Report
      2009 Annual Research Report
  • [Presentation] 表面活性化によるGeウェハの常温接合2009

    • Author(s)
      倉山竜二
    • Organizer
      第70回応用物理学会学術講演会
    • Place of Presentation
      富山
    • Related Report
      2009 Annual Research Report
  • [Presentation] Effect of Low-Pressure Ar Plasma Treatment on Micro-Bump Bonding2009

    • Author(s)
      王英輝
    • Organizer
      2009年度精密工学会春季大会学術講演会
    • Place of Presentation
      東京
    • Related Report
      2008 Annual Research Report
  • [Presentation] 金属薄膜を介したシリコンウエハ低温接合2009

    • Author(s)
      谷山慎悟
    • Organizer
      第23回エレクトロニクス実装学会講演大会
    • Place of Presentation
      東京
    • Related Report
      2008 Annual Research Report
  • [Presentation] 20-μm-Pitch Au Micro-bump Interconnection at Room Temperature in Ambient Air2008

    • Author(s)
      王英輝
    • Organizer
      the 58th Electronic Components and Technology Conference (ECTC2008)
    • Place of Presentation
      Florida, USA
    • Related Report
      2008 Annual Research Report
  • [Presentation] Influence of Surface Contamination on Low-Temperature Bonding of 20-μm-Pitch Au Micro-Bumps2008

    • Author(s)
      王英輝
    • Organizer
      International Conference on Electronics Packaging (ICEP2008)
    • Place of Presentation
      東京
    • Related Report
      2008 Annual Research Report
  • [Presentation] High-Precision Alignment for Low Temperature Wafer Bonding2008

    • Author(s)
      Chenxi Wang
    • Organizer
      ECS Transactions
    • Place of Presentation
      Hawaii, USA
    • Related Report
      2008 Annual Research Report
  • [Presentation] The Chip-on-Board Bonding Using Non-Conductive Film and Metallic Bumps by the Surface Activated Bonding Method2008

    • Author(s)
      王英輝
    • Organizer
      IEEE 9^<th> VLSI Packaging Workshop in Japan
    • Place of Presentation
      京都
    • Related Report
      2008 Annual Research Report
  • [Presentation] Room Temperature Wafer Bonding Using Surface Activated Bonding Method2008

    • Author(s)
      王英輝
    • Organizer
      IEEE 9^<th> VLSI Packaging Workshop in Japan
    • Place of Presentation
      京都
    • Related Report
      2008 Annual Research Report

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Published: 2008-04-01   Modified: 2024-03-26  

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