Development of high speed plating of diamond wire tool for solar battery wafers and slicing characteristics of diamond wire tool
| Project/Area Number |
23560138
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Kanazawa Institute of Technology |
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Principal Investigator |
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| Project Period (FY) |
2011 – 2013
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| Project Status |
Completed (Fiscal Year 2013)
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| Budget Amount *help |
¥5,330,000 (Direct Cost: ¥4,100,000、Indirect Cost: ¥1,230,000)
Fiscal Year 2013: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2012: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2011: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
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| Keywords | スライシング加工 / ワイヤソー / スライシング / 切断加工 / ダイヤモンドワイヤ工具 / 太陽電池用ウェハー |
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| Research Abstract |
The multi-wire saw is a major slicing method to manufacture the silicon wafers for the solar battery. This multi-wire saw processing method comes in two types of free and fixed abrasive methods. Nowadays, the fixed abrasive method is paid attention for one of high speed and high accuracy slicing.
This study aims for the decrease of wire cost and kerf-loss and the improvement of slicing characteristics. The high speed plating method to make the diamond wire tool is developed and the relations between the influence factor of the diamond wire tool and slicing characteristics are clear in this report.
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Report
(4 results)
Research Products
(18 results)
