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Development of fully-implanted low-power retinal prosthesis system with visual information processing functions

Research Project

Project/Area Number 24246060
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Research Field Electron device/Electronic equipment
Research InstitutionTohoku University

Principal Investigator

TANAKA Tetsu  東北大学, 医工学研究科, 教授 (40417382)

Co-Investigator(Kenkyū-buntansha) KIYOYAMA Kouji  長崎総合科学大学, 工学部, 准教授 (60412722)
TOMITA Hiroshi  岩手大学, 工学部, 教授 (40302088)
FUKUSHIMA Takafumi  東北大学, 未来科学技術共同研究センター, 准教授 (10374969)
KOYANAGI Mitsumasa  東北大学, 未来科学技術共同研究センター, 教授 (60205531)
Project Period (FY) 2012-04-01 – 2015-03-31
Project Status Completed (Fiscal Year 2014)
Budget Amount *help
¥44,850,000 (Direct Cost: ¥34,500,000、Indirect Cost: ¥10,350,000)
Fiscal Year 2014: ¥10,790,000 (Direct Cost: ¥8,300,000、Indirect Cost: ¥2,490,000)
Fiscal Year 2013: ¥14,690,000 (Direct Cost: ¥11,300,000、Indirect Cost: ¥3,390,000)
Fiscal Year 2012: ¥19,370,000 (Direct Cost: ¥14,900,000、Indirect Cost: ¥4,470,000)
Keywords人工網膜 / 視覚情報処理 / 三次元集積回路 / 半導体神経工学 / 3次元集積回路 / 高次視覚処理
Outline of Final Research Achievements

In order to restore visual sensation of blind patients such as age-related macular degeneration and retinitis pigmentosa, a fully implantable retinal prosthesis system have been developed in this research. The fully implantable retinal prosthesis system consists of an intraocular and extraocular units. The intraocular unit has a coupling coil, a stimulus electrode array, and a 3-D stacked retinal prosthesis chip. The 3-D stacked retinal prosthesis chip is composed of a photoreceptor chip and a stimulus current generator chip. In this research, the photoreceptor chip was successfully developed with a switching photosensitivity function, and the stimulus current generator chip was also successfully developed with an edge enhancement function. Both chips has 37x37 pixels.
The retinal prosthesis chip assembled with the flexible cable was completely implanted into a rabbit eyeball, and appropriate EEP waveforms were successfully recorded with incidents of light from outside the eyeball.

Report

(4 results)
  • 2014 Annual Research Report   Final Research Report ( PDF )
  • 2013 Annual Research Report
  • 2012 Annual Research Report
  • Research Products

    (59 results)

All 2015 2014 2013 2012 Other

All Journal Article (9 results) (of which Peer Reviewed: 9 results) Presentation (49 results) (of which Invited: 10 results) Remarks (1 results)

  • [Journal Article] Reconfigured-Wafer-to-Wafer 3D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film2014

    • Author(s)
      Takafumi Fukushima, Ji Cheol Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE TRANSACTIONS ON ELECTRON DEVICES

      Volume: Vol.61, No.2 Issue: 2 Pages: 533-539

    • DOI

      10.1109/ted.2013.2294831

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice2014

    • Author(s)
      Mariappan Murugesan,Yasuhiko Imai,Shigeru Kimura, Takafumi Fukushima, Ji Cheol Bea,Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE TRANSACTIONS ON ELECTRON DEVICES

      Volume: 61 Issue: 2 Pages: 540-546

    • DOI

      10.1109/ted.2013.2295463

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology2014

    • Author(s)
      K.-W. Lee, H. Hashimoto, M. Onishi, Y. Sato, C. Nagai, M. Murugesan, J.-C. Bea, T. Fukushima, T. Tanaka, M. Koyanagi
    • Journal Title

      IEEE International Electron Devices Meeting (IEDM) Technical Digest

      Volume: - Pages: 669-672

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013

    • Author(s)
      Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan,Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE TRANSACTIONS ON ELECTRON DEVICES

      Volume: VOL.60, NO.11 Issue: 11 Pages: 3842-3848

    • DOI

      10.1109/ted.2013.2280273

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Development and In Vivo Evaluation of Conductive Polymer (PEDOT) Stimulus Electrodes for Fully Implantable Retinal Prosthesis2013

    • Author(s)
      Chikashi kigure, Hideki Naganuma, Yuichiro Sasaki, Hiroshi Kino, Tetsu Tanaka
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 52 Issue: 4S Pages: 04CL03-04CL03

    • DOI

      10.7567/jjap.52.04cl03

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Reductant-Assisted Self-Assembly with Cu/Sn Microbump for Three-Dimensional Heterogeneous Integration2013

    • Author(s)
      Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      Japanese Journal of Applied Physics (JJAP)

      Volume: 52 Issue: 4S Pages: 04CB09-04CB09

    • DOI

      10.7567/jjap.52.04cb09

    • NAID

      210000141985

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration2013

    • Author(s)
      Hisashi Kino, Ji Cheol Bea, Mariappan Murugesan, Kang, Wook Lee,Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 52

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Pillar-shaped stimulus electrode array for high-efficiency stimulation of fully implantable epiretinal prosthesis2012

    • Author(s)
      Kang-Wook Lee
    • Journal Title

      JOURNAL of Micromechanics and Microengineering

      Volume: 22 Issue: 10 Pages: 105015-105015

    • DOI

      10.1088/0960-1317/22/10/105015

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Low-Resistance Cu-Sn Electroplated Evaporated Microbumps for 3D Chip Stacking2012

    • Author(s)
      M. MURUGESAN, Y. OHARA, T. FUKUSHIMA, T. TANAKA, and M. KOYANAGI
    • Journal Title

      Journal of ELECTRONIC MATERIALS

      Volume: Vol.41(4) Issue: 4 Pages: 720-729

    • DOI

      10.1007/s11664-012-1949-1

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Presentation] 高分子材料を用いた三次元集積技術I:セルフアセンブリによるNCF被覆ダイ・オン・ウェーハ2015

    • Author(s)
      伊藤有香,福島誉史,Murugesan Mariappan,裵 志哲,李 康旭,田中 徹,小柳光正
    • Organizer
      第29回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京大学本郷キャンパス、東京都
    • Year and Date
      2015-03-16 – 2015-03-18
    • Related Report
      2014 Annual Research Report
  • [Presentation] 高分子材料を用いた三次元集積技術II:ビアラストTSV形成のための高耐熱テンポラリー無機接着層2015

    • Author(s)
      橋口日出登,福島誉史,裵 志哲,Murugesan Mariappan,李 康旭,田中 徹,小柳光正
    • Organizer
      第29回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京大学本郷キャンパス、東京都
    • Year and Date
      2015-03-16 – 2015-03-18
    • Related Report
      2014 Annual Research Report
  • [Presentation] 表層刺激電極を有する網膜下埋植人工網膜チップモジュールの作製2015

    • Author(s)
      後藤 大輝、長沼 秀樹、木野 久志、田中 徹
    • Organizer
      第62回応用物理学会春季学術講演会
    • Place of Presentation
      東海大学湘南キャンパス、神奈川県、平塚市
    • Year and Date
      2015-03-11 – 2015-03-14
    • Related Report
      2014 Annual Research Report
  • [Presentation] 3次元集積化技術が拓くDiversificationの未来 - From LSI of scale to LSI of scope2015

    • Author(s)
      田中 徹
    • Organizer
      第62回応用物理学会春季学術講演会 S-16シンポジウム
    • Place of Presentation
      東海大学湘南キャンパス、神奈川県、平塚市
    • Year and Date
      2015-03-11 – 2015-03-14
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] 三次元集積化における異種材料間の熱膨張係数差がおよぼす影響2015

    • Author(s)
      木野 久志、池ヶ谷 俊介、小柳 光正、田中 徹
    • Organizer
      第62回応用物理学会春季学術講演会 S-16シンポジウム
    • Place of Presentation
      東海大学湘南キャンパス、神奈川県、平塚市
    • Year and Date
      2015-03-11 – 2015-03-14
    • Related Report
      2014 Annual Research Report
  • [Presentation] 生体埋め込み型バイオメディカル集積デバイスの開発~人の感覚を代行するセンサ応用システム~2015

    • Author(s)
      田中 徹
    • Organizer
      第16回半導体パッケージング技術展専門技術セミナー【ICP-6】
    • Place of Presentation
      東京ビッグサイト、東京
    • Year and Date
      2015-01-15
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] Cu Seeding Using Electroless Deposition on Ru Liner for High Aspect Ratio Through-Si Vias2014

    • Author(s)
      Fumihiro Inoue, Harold Philipsen, Marleen H. Van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, and Tetsu Tanaka
    • Organizer
      2014 IEEE International Conference on 3D System Integration (3DIC)
    • Place of Presentation
      Kinsale, Cork Ireland
    • Year and Date
      2014-12-01 – 2014-12-03
    • Related Report
      2014 Annual Research Report
  • [Presentation] Tiny VCSEL Chip Self-Assembly for Advanced Chip-to-Wafer 3D and Hetero Integration2014

    • Author(s)
      Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Organizer
      2014 IEEE International Conference on 3D System Integration (3DIC)
    • Place of Presentation
      Kinsale, Cork Ireland
    • Year and Date
      2014-12-01 – 2014-12-03
    • Related Report
      2014 Annual Research Report
  • [Presentation] Effects of Electro-less Ni Layer as Barrier/Seed Layers for High Reliable and Low Cost Cu TSV12014

    • Author(s)
      K.W. Lee, C. Nagai, A. Nakamura, J.C. Bea, M. Murugesan, T. Fukushima, T. Tanaka and M. Koyanagi
    • Organizer
      2014 IEEE International Conference on 3D System Integration (3DIC)
    • Place of Presentation
      Kinsale, Cork Ireland
    • Year and Date
      2014-12-01 – 2014-12-03
    • Related Report
      2014 Annual Research Report
  • [Presentation] 3D Hetero-Integration Technology for Innovative Convergence Systems2014

    • Author(s)
      K-W. Lee, T. Fukushima, T. Tanaka, and M. Koyanagi
    • Organizer
      Electronics Packaging Symposium
    • Place of Presentation
      Binghamton, NY, USA
    • Year and Date
      2014-10-08 – 2014-10-09
    • Related Report
      2014 Annual Research Report
  • [Presentation] 3D IC用ビアラスト・バックサイドビアプロセスにおけるプラズマダメージのMOSFET特性への影響評価2014

    • Author(s)
      菅原陽平,橋口日出登,谷川星野,木野久志,福島誉史,李康旭,小柳光正,田中徹
    • Organizer
      第75回応用物理学会秋季学術講演会
    • Place of Presentation
      北海道大学札幌キャンパス、北海道、札幌市
    • Year and Date
      2014-09-17 – 2014-09-20
    • Related Report
      2014 Annual Research Report
  • [Presentation] Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC2014

    • Author(s)
      Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, and Tetsu Tanaka
    • Organizer
      International Conference on Solid State Devices and Materials (SSDM2014)
    • Place of Presentation
      Tsukuba International Congress Center EPOCHAL TSUKUBA, Tsukuba, Ibaraki, Japan
    • Year and Date
      2014-09-08 – 2014-09-11
    • Related Report
      2014 Annual Research Report
  • [Presentation] Implantable electronic devices based on semiconductor neural engineering2014

    • Author(s)
      Tetsu Tanaka
    • Organizer
      The 6th IEEE International Nanoelectronics Conference 2014 (INEC2014)
    • Place of Presentation
      Hokkaido University, Sapporo, Hokkaido, Japan
    • Year and Date
      2014-07-28 – 2014-07-31
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] Highly Thermoresistant Temporary Bonding/Debonding System without Organic Adhesives for 3D Integration2014

    • Author(s)
      H. Hashiguchi, T. Fukushima, M. Murugesan, J. -C. Bea, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
    • Organizer
      2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2014)
    • Place of Presentation
      The University of Tokyo, Hongo, Tokyo, Japan
    • Year and Date
      2014-07-15 – 2014-07-16
    • Related Report
      2014 Annual Research Report
  • [Presentation] 網膜下刺激完全埋め込み型人工網膜チップのチップ表層刺激電極の開発2014

    • Author(s)
      笹木悠一郎, 鈴木拓志, 岩上卓磨, 谷卓治, 長沼秀樹, 木野久志, Jari Hyttinen, Minna Kellomaki, 田中徹
    • Organizer
      第53回日本生体医工学大会
    • Place of Presentation
      仙台国際センター、宮城県、仙台市
    • Year and Date
      2014-06-24 – 2014-06-26
    • Related Report
      2014 Annual Research Report
  • [Presentation] Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits2014

    • Author(s)
      Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
    • Organizer
      2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Lake Buena Vista, Florida, USA
    • Year and Date
      2014-05-27 – 2014-05-30
    • Related Report
      2014 Annual Research Report
  • [Presentation] Temporary Spin-on Glass Bonding Technologies for Via-Last/Backside-Via 3D Integration Using Multichip Self-Assembly2014

    • Author(s)
      H. Hashiguchi, T. Fukushima, A. Noriki, H. Kino, K..-W. Lee, T. Tanaka, M. Koyanagi
    • Organizer
      2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Lake Buena Vista, Florida, USA
    • Year and Date
      2014-05-27 – 2014-05-30
    • Related Report
      2014 Annual Research Report
  • [Presentation] Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive2014

    • Author(s)
      H.Kino, H.Hashiguchi, Y.Sugawara, S.Tanikawa, T.Fukushima, K-W.Lee, M.Koyanagi, and T.Tanaka
    • Organizer
      2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Lake Buena Vista, Florida, USA
    • Year and Date
      2014-05-27 – 2014-05-30
    • Related Report
      2014 Annual Research Report
  • [Presentation] Electroless Cu Seed on Ru and Co Liners in High Aspect Ratio TSV2014

    • Author(s)
      F. Inoue, H. Philipsen, M. H. van der Veen, S. Van Huylenbroeck, S. Armini, H. Struyf, T. Tanaka
    • Organizer
      2014 IEEE Interconnect Technology Conference (IITC2014)
    • Place of Presentation
      San Jose, CA, USA
    • Year and Date
      2014-05-20 – 2014-05-23
    • Related Report
      2014 Annual Research Report
  • [Presentation] New Temporary Bonding Technology with Spin-on Glass and Hydrogenated Amorphous Si for 3D LSIs2014

    • Author(s)
      H. Hashiguchi, T. Fukushima, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi
    • Organizer
      2014 International Conference on Electronics Packaging (ICEP2014)
    • Place of Presentation
      Toyama International Convention Center, Toyama, Toyama, Japan
    • Year and Date
      2014-04-23 – 2014-04-25
    • Related Report
      2014 Annual Research Report
  • [Presentation] Study of Fully Implantable Retinal Prosthesis with 3-D Stacked Retinal Prosthesis Chip2014

    • Author(s)
      Hideki Naganuma, Takaharu Tani, Hisashi Kino, Kouji Kiyoyama, Tetsu Tanaka
    • Organizer
      SRP of International Solid-State Circuits Conference 2014(ISSCC2014)
    • Place of Presentation
      San Francisco, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] 三次元集積化におけるTSV作製プロセスがトランジスタ特性に及ぼす影響評価2014

    • Author(s)
      菅原陽平, 谷川星野, 橋口日出登, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹
    • Organizer
      平成26年電気学会全国大会
    • Place of Presentation
      愛媛大学(松山)
    • Related Report
      2013 Annual Research Report
  • [Presentation] Chip-to-Wafer 3D Stacking Using Self-Assembly and Electrostatic Temporary Bonding/Debonding2013

    • Author(s)
      H. Hashiguchi, T. Fukushima, J. Bea, H. Kino, K.-W. Lee, T.Tanaka, M. Koyanagi
    • Organizer
      International Conference on Electronics Packaging 2013 (ICEP2013)
    • Place of Presentation
      Osaka International Convention Center(大阪)
    • Related Report
      2013 Annual Research Report
  • [Presentation] 完全埋め込み型人工網膜のためのエッジ強調機能を有する37×37ピクセル人工網膜チップ2013

    • Author(s)
      長沼秀樹, 谷卓治, 笹木悠一郎, 渡辺洋太, 木野久志, 清山浩司, 田中徹
    • Organizer
      電子情報通信学会集積回路研究専門LSIとシステムのワークショップ
    • Place of Presentation
      北九州国際会議場(福岡)
    • Related Report
      2013 Annual Research Report
  • [Presentation] 3D-LSI/TSVの技術動向と実用化2013

    • Author(s)
      田中徹(代理発表:木野久志)
    • Organizer
      SEMI FORUM JAPAN 2013-TSV/3次元積層化技術セミナー
    • Place of Presentation
      グランキューブ大阪(大阪)
    • Related Report
      2013 Annual Research Report
  • [Presentation] Flux-Assisted Self-Assembly with Microbump Bonding for 3D Heterogeneous Integration2013

    • Author(s)
      Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
    • Organizer
      63rd Electronic Components and Technology Conference 2013
    • Place of Presentation
      Las Vegas, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] 完全埋め込み型人工網膜のための視覚情報処理機能を有する37x37ピクセル人工網膜チップ2013

    • Author(s)
      長沼秀樹, 谷卓治, 笹木悠一郎, 渡辺洋太, 木野久志, 清山浩司, 田中徹
    • Organizer
      2013年包括脳夏のワークショップ
    • Place of Presentation
      名古屋国際会議場(名古屋)
    • Related Report
      2013 Annual Research Report
  • [Presentation] 室温硬化型樹脂による3DIC内の機械応力低減に関する検討2013

    • Author(s)
      木野 久志, 福島 誉史, 小柳 光正, 田中 徹
    • Organizer
      2013秋季第74 回応用物理学会秋季学術講演会
    • Place of Presentation
      同志社大学京田辺キャンパス(京田辺)
    • Related Report
      2013 Annual Research Report
  • [Presentation] Ultralow Power Operation of 3-D Stacked Retinal Prosthesis Chip with Edge Enhancement Function2013

    • Author(s)
      Hideki Naganuma, Takaharu Tani, Hisashi Kino, Kouji Kiyoyama, and Tetsu Tanaka
    • Organizer
      2013 International Conference on Solid State Materials and Devices(SSDM2013)
    • Place of Presentation
      Hilton Fukuoka Sea Hawk(福岡)
    • Related Report
      2013 Annual Research Report
  • [Presentation] Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D IC2013

    • Author(s)
      H. Kino, T. Fukushima, K. -W. Lee, M. Koyanagi, T. Tanaka
    • Organizer
      2013 International Conference on Solid State Materials and Devices(SSDM2013)
    • Place of Presentation
      Hilton Fukuoka Sea Hawk(福岡)
    • Related Report
      2013 Annual Research Report
  • [Presentation] 高次視覚情報処理機能を有する完全埋め込み型人工網膜の開発2013

    • Author(s)
      田中徹
    • Organizer
      第51回日本人工臓器学会ワークショップ「人工臓器におけるセンシング技術」
    • Place of Presentation
      パシフィコ横浜(横浜)
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] A Block-Parallel ADC with Digital Noise Cancelling for 3-D Stacked CMOS Image Sensor2013

    • Author(s)
      K.Kiyoyama, Y.Sato, H.Hashimoto, K-W Lee, T.Fukushima, T.Tanaka, and M.Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference 2013
    • Place of Presentation
      San Francisco, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] Development of Via-Last 3D Integration Technologies Using a New Temporary Adhesive System2013

    • Author(s)
      T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, and M. Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference 2013
    • Place of Presentation
      San Francisco, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] Analysis of Low Power Characteristics of 3-D Stacked Retinal Proshtesis Chip2013

    • Author(s)
      Hideki Naganuma, Takaharu Tani, Hisashi Kino, Kouji Kiyoyama, Tetsu Tanaka
    • Organizer
      7th East Asian Consortium on Biomedical Engineering
    • Place of Presentation
      Taipei, Taiwan
    • Related Report
      2013 Annual Research Report
  • [Presentation] 機能性液体を用いた自己組織化チップ実装技術2013

    • Author(s)
      伊藤 有香
    • Organizer
      第27回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      宮城
    • Related Report
      2012 Annual Research Report
  • [Presentation] エッジ強調機能を有する3次元積層人工網膜チップの低電力特性2013

    • Author(s)
      長沼 秀樹
    • Organizer
      2013年電子情報通信学会総合大会
    • Place of Presentation
      岐阜
    • Related Report
      2012 Annual Research Report
  • [Presentation] 帯域切換及び利得切換機能を有するマルチ生体信号記録モジュールの設計と評価2013

    • Author(s)
      谷 卓治
    • Organizer
      2013年電子情報通信学会総合大会
    • Place of Presentation
      岐阜
    • Related Report
      2012 Annual Research Report
  • [Presentation] 高解像網膜下刺激人工網膜モジュールの開発2013

    • Author(s)
      木暮 爾
    • Organizer
      2013年第60回応用物理学会春季学術講演会
    • Place of Presentation
      神奈川
    • Related Report
      2012 Annual Research Report
  • [Presentation] 半導体神経工学に基づくバイオメディカル集積デバイスの開発2013

    • Author(s)
      田中 徹
    • Organizer
      2013年第60回応用物理学会春季学術講演会
    • Place of Presentation
      神奈川
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] Optical Interconnection Technology for 3-D LSI and Neural Engineering2012

    • Author(s)
      T. Tanaka
    • Organizer
      2012 IEEE International Interconnect Technology Conference (IITC2012)
    • Place of Presentation
      San Jose, USA
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] 先端三次元積層型LSIの技術動向と展望2012

    • Author(s)
      福島 誉史
    • Organizer
      TSV/3次元積層化技術セミナー
    • Place of Presentation
      大阪
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] 完全埋め込み型人工網膜のための感度切替型受光回路チップの開発2012

    • Author(s)
      長沼 秀樹
    • Organizer
      2012年秋季第73回応用物理学会学術講演会
    • Place of Presentation
      愛媛
    • Related Report
      2012 Annual Research Report
  • [Presentation] 完全埋め込み型人工網膜用Ptナノワイヤ刺激電極アレイの開発2012

    • Author(s)
      木暮 爾
    • Organizer
      2012年秋季第73回応用物理学会学術講演会
    • Place of Presentation
      愛媛
    • Related Report
      2012 Annual Research Report
  • [Presentation] A 37×37 Pixels Photoreceptor Chip with Switchable Photosensitivity Circuit for 3-D Stacked Retinal Prosthesis Chip2012

    • Author(s)
      Hideki Naganuma
    • Organizer
      2012 International Conference on Solid State Devices and Materials (SSDM 2012)
    • Place of Presentation
      Kyoto, Japan
    • Related Report
      2012 Annual Research Report
  • [Presentation] Development and In Vivo Evaluation of Conductive Polymer(PEDOT) Stimulus  Electrodes for Fully Implantable Retinal Prosthesis2012

    • Author(s)
      Chikashi Kigure
    • Organizer
      2012 International Conference on Solid State Devices and Materials (SSDM 2012)
    • Place of Presentation
      Kyoto, Japan
    • Related Report
      2012 Annual Research Report
  • [Presentation] Development of 3D Integration Technologies and Recent Challenges2012

    • Author(s)
      T. Fukushima
    • Organizer
      ADMETA Plus 2012 Advanced Metallization Conference 2012
    • Place of Presentation
      Tokyo, Japan
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] A 37×37 Pixels Artificial Retina Chip with Edge Enhancement Function for 3-D Stacked Fully Implantable Retinal Prosthesis2012

    • Author(s)
      H. Naganuma
    • Organizer
      IEEE Biomedical Circuits and Systems Conference(Bio CAS 2012)
    • Place of Presentation
      Hsinchu, Taiwan
    • Related Report
      2012 Annual Research Report
  • [Presentation] 3D-IC用超高密度TSV技術の信頼性

    • Author(s)
      田中徹
    • Organizer
      日本学術振興会半導体界面制御技術第154委員会
    • Place of Presentation
      東京大学(東京)
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] 集積回路の未来

    • Author(s)
      田中徹
    • Organizer
      第29回京都賞記念ワークショップ先端技術部門パネル討論
    • Place of Presentation
      国立京都国際会館(京都)
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Remarks] 完全埋め込み型人工網膜

    • URL

      http://www.lbc.mech.tohoku.ac.jp/index.html

    • Related Report
      2014 Annual Research Report

URL: 

Published: 2013-05-15   Modified: 2019-07-29  

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