Research Project
Grant-in-Aid for Young Scientists (B)
We have developed flexible TEG modules for applying to heat sources with the curved surface such as exhaust pipes using ICA packaging technology. The module concept is that a mass of small Bi-Te thermoelectric chips are tightly mounted on a thin film substrate and connected with flexible and stretchable ICAs by printing technique. Fabricated TEG modules with 250 p-n pairs of thermoelectric chips have been evaluated in detail.
All 2015 2014 2013
All Journal Article (6 results) (of which Peer Reviewed: 6 results, Acknowledgement Compliant: 1 results) Presentation (13 results) (of which Invited: 4 results)
J. Am. Ceram. Soc.
Volume: 10 Issue: 10 Pages: 3238-3243
10.1111/jace.13116
Thin Sol. Film
Volume: 28 Pages: 11-18
10.1016/j.tsf.2014.06.036
ACS Appl. Mater. Interfaces
Volume: 18 Issue: 18 Pages: 16297-16303
10.1021/am504509r
RSC Adv.
Volume: 4 Issue: 31 Pages: 15914-15922
10.1039/c4ra00292j
Journal of Asian Ceramic Societies
Volume: 1 Issue: 3 Pages: 282-288
10.1016/j.jascer.2013.06.006
Langmuir
Volume: 29 Issue: 35 Pages: 11192-11197
10.1021/la402026r